Semiconductor package

Abstract

A semiconductor package includes a base substrate on which semiconductor elements are disposed; a covering member which is provided to the base substrate, which covers the semiconductor elements, and which includes an opening at an end thereof at the side of the base substrate; and a connector substrate which is provided on the base substrate in a manner that the connector substrate closes the opening, which includes a first high-frequency signal line in an area located inside the covering member for a first surface, and which includes a second high-frequency signal line on a second surface being a surface on the opposite side of the first surface, the second high-frequency signal line being electrically connected to the first high-frequency signal line; wherein the base substrate is formed in a manner that the base substrate is located away from the second high-frequency signal line.

1 . A semiconductor package comprising:
 a base substrate on which semiconductor elements are disposed;   a covering member which is provided to the base substrate, which covers the semiconductor elements, and which includes an opening at an end thereof at the side of the base substrate; and   a connector substrate which is provided on the base substrate in a manner that the connector substrate closes the opening, which includes a first high-frequency signal line in an area located inside the covering member for a first surface, and which includes a second high-frequency signal line on a second surface being a surface on the opposite side of the first surface, the second high-frequency signal line being electrically connected to the first high-frequency signal line;   wherein the base substrate is formed in a manner that the base substrate is located away from the second high-frequency signal line.   
   
   
       2 . The semiconductor package according to  claim 1 , wherein the base substrate includes a concave part which faces the second high-frequency signal line, and which is located away from the second high-frequency signal line. 
   
   
       3 . The semiconductor package according to  claim 1 , wherein the base substrate includes a notch part located away from the second high-frequency signal line.