Method and apparatus for forming multi-layered circuits using liquid crystalline polymers

Abstract

A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

1 . An apparatus for forming multi-layered circuits comprising: 
 a press having top and bottom platens capable of applying pressure to a material stack located between the plates; and    a fixture positioned between the platens having an opening therein in which to position the material stack.    
     
     
         2 . The apparatus of  claim 1  further comprising a top caul plate positioned between the top platen and the fixture and a bottom caul plate positioned between the bottom platen and the fixture.  
     
     
         3 . The apparatus of  claim 2  further comprising a top separator plate positioned between the top caul plate and the fixture and a bottom separator plate positioned between the bottom caul plate and the fixture.  
     
     
         4 . The apparatus of  claim 3  further comprising a vacuum enclosure positioned around the fixture and the material stack.  
     
     
         5 . The apparatus of  claim 3  further comprising a first release sheet positioned on top of the bottom separator plate.  
     
     
         6 . The apparatus of  claim 1  further comprising at least one pin inserted in the fixture to hold the fixture in place.  
     
     
         7 . A fixture for placement between top and bottom platens in a press wherein the fixture includes an opening in which to position a material stack for lamination.  
     
     
         8 . The fixture of  claim 7  further comprising a slot connecting the opening to an exterior of the fixture for retaining a connection between the material stack and a thermocouple.  
     
     
         9 . An apparatus for forming multi-layered circuits comprising: 
 At least one roller capable of applying pressure to a material stack located between the plates; and    a fixture positioned under said at least one roller wherein the fixture has an opening therein in which to position the material stack.