US2007237480A1PendingUtilityA1

Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom

34
Assignee: WARDZALA LEONARD JPriority: Jun 16, 2003Filed: Feb 21, 2007Published: Oct 11, 2007
Est. expiryJun 16, 2023(expired)· nominal 20-yr term from priority
H10W 70/098H10W 70/05G02B 6/4228H05K 2203/1126H05K 1/092H05K 3/1291H05K 3/368H05K 1/0306H05K 3/321Y10T29/49812
34
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.

Claims

exact text as granted — not AI-modified
1 . (canceled)  
   
   
       2 . (canceled)  
   
   
       3 . (canceled)  
   
   
       4 . (canceled)  
   
   
       5 . (canceled)  
   
   
       6 . (canceled)  
   
   
       7 . (canceled)  
   
   
       8 . (canceled)  
   
   
       9 . (canceled)  
   
   
       10 . (canceled)  
   
   
       11 . (canceled)  
   
   
       12 . (canceled)  
   
   
       13 . (canceled)  
   
   
       14 . (canceled)  
   
   
       15 . (canceled)  
   
   
       16 . (canceled)  
   
   
       17 . (canceled)  
   
   
       18 . (canceled)  
   
   
       19 . (canceled)  
   
   
       20 . (canceled)  
   
   
       21 . (canceled)  
   
   
       22 . (canceled)  
   
   
       23 . An apparatus comprising: 
 a first ceramic subassembly having a first circuit fabricated on a first side thereof; and,    a second ceramic subassembly having a second circuit fabricated on a first side thereof,    wherein the first ceramic subassembly is joined to the second ceramic subassembly by metal layers that are selectively printed on one of a second side of the first ceramic subassembly and a second side of the second ceramic subassembly, dried and co-fired.    
   
   
       24 . The apparatus as set forth in  claim 23  wherein the apparatus is a fiber optic transmitter.  
   
   
       25 . The apparatus as set forth in  claim 23  wherein the metal layers are fabricated of a platinum and silver alloy.  
   
   
       26 . The apparatus as set forth in  claim 23  wherein the metal layers are fabricated of silver.  
   
   
       27 . The apparatus as set forth in  claim 23  wherein the metal layers are fabricated of gold.  
   
   
       28 . The apparatus as set forth in  claim 23  wherein the metal layers are fabricated of a thick film cermet material.  
   
   
       29 . The apparatus as set forth in  claim 23  wherein the metal layers are fabricated of gold.  
   
   
       30 . The apparatus as set forth in  claim 23  wherein the metal layers are fabricated of a thick film cermet material.  
   
   
       31 . The apparatus as set forth in  claim 30  wherein the cermet material has a firing range of 500° Celsius to 950° Celsius.  
   
   
       32 . The apparatus as set forth in  claim 23  wherein the first and second ceramic subassemblies are fabricated of 96% alumina.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.