Composite stamper for imprint lithography

Abstract

A stamper having a patterned layer composed of a hard material and a compressible material back plane layer. The back plane layer may be composed of an elastomer. The stamper may be used to imprint an embossable layer disposed above a substrate for the production of a magnetic recording disk.

1 . A method, comprising: 
 providing a stamper, the stamper comprising: 
 a patterned layer comprising a hard material, the patterned layer having a back plane; and  
 a back plane layer directly bonded to the back plane of the patterned layer, the back plane layer comprising a compressible material; and  
   imprinting the patterned layer into an embossable layer, the embossable layer being disposed above a substrate.    
     
     
         2 . The method of  claim 1 , wherein the hard material comprises a rigid material.  
     
     
         3 . The method of  claim 1 , wherein the compressible material comprises an elastomer.  
     
     
         4 . The method of  claim 1 , wherein the embossable layer comprises a deformable solid.  
     
     
         5 . The method of  claim 1 , wherein the stamper is used to imprint the embossable layer for production of a magnetic recording disk.  
     
     
         6 . The method of  claim 3 , wherein the stamper is used to imprint the embossable layer for production of a magnetic recording disk.  
     
     
         7 . The method of  claim 1 , wherein imprinting comprises applying a pressure to the back plane layer in an approximate range of 10 to 2,000 psi.  
     
     
         8 . The method of  claim 1 , wherein the stamper is used to imprint the embossable layer for production of an optical recording disk.  
     
     
         9 . The method of  claim 1 , wherein the stamper is used to imprint the embossable layer for production of a display.  
     
     
         10 . The method of  claim 1 , wherein the stamper is used to imprint the embossable layer for production of a semiconductor device.  
     
     
         11 . The method of  claim 1 , wherein the embossable layer is imprinted with a feature having a lateral dimension less than approximately 100 nm.  
     
     
         12 . A method of manufacturing a stamper, comprising: 
 generating a patterned layer having a back plane, the patterned layer comprising a hard material; and    directly bonding a compressible material on the back plane of the patterned layer.    
     
     
         13 . The method of  claim 12 , wherein the hard material comprises a rigid material.  
     
     
         14 . The method of  claim 12 , further comprising curing the compressible material.  
     
     
         15 . The method of  claim 12 , wherein generating a patterned layer comprises electroplating a master with a metal.  
     
     
         16 . The method of  claim 12 , further comprising: 
 disposing a masking layer on the back plane of the patterned layer;    forming an outer wall on the back plane around the masking layer;    removing the masking layer; and    disposing the compressible material on the back plane within the outer wall.    
     
     
         17 . The method of  claim 15 , further comprising curing the compressible material after the compressible material is disposed on the back plane.  
     
     
         18 . The method of  claim 17 , wherein curing is performed at a temperature approximately in a range of room temperature to 150 degrees C.  
     
     
         19 . The method of  claim 12 , further comprising: 
 forming an outer wall around the patterned layer to form a cavity above the back plane of the patterned layer; and    disposing the compressible material on the back plane of the patterned layer within the outer wall.    
     
     
         20 . The method of  claim 19 , further comprising curing the compressible material.  
     
     
         21 . The method of  claim 12 , wherein the hard material has a hardness value in approximately a range of HV100 to HV1000.  
     
     
         22 . The method of  claim 12 , wherein the compressible material has a hardness value in approximately a range of 20 to 25 Shore 00 scale.  
     
     
         23 . The method of  claim 12 , wherein the compressible material has a hardness value in approximately a range of 10 to 100 Shore A scale.