US2007246555A1PendingUtilityA1

Heat Conveyance System

47
Assignee: NISHIMURA TADAFUMIPriority: Jul 9, 2004Filed: Jul 8, 2005Published: Oct 25, 2007
Est. expiryJul 9, 2024(expired)· nominal 20-yr term from priority
F25B 1/00F25B 5/00F25B 5/02F25B 29/00F24D 2200/123F24D 3/12Y02B30/00F24D 2220/08F24D 12/02F25B 2400/06F25B 29/003F24D 11/0214F24D 17/02F24D 2200/32F25B 2339/047F25B 25/005F24D 3/08
47
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Claims

Abstract

A heating medium circuit ( 90 ) is provided with a plurality of circulation pipelines ( 40, 49 ) along each of which a heat source side appliance ( 11 ), a utilization side appliance ( 13, 45 ), and a pump ( 41, 42 ) are arranged to be capable of operation to cause a heating medium to circulate between the heat source side appliance ( 11 ) and the utilization side appliance ( 13, 45 ). A high temperature side communication pipe ( 91 ) establishes fluid communication between a part between the outflow side of the heat source side appliance ( 11 ) and the inflow side of the utilization side appliance ( 13, 45 ) in the circulation pipeline ( 40 ) and a part between the outflow side of the heat source side appliance ( 11 ) and the inflow side of the utilization side appliance ( 13, 45 ) in the circulation pipeline ( 49 ). In addition, a low temperature side communication pipe ( 92 ) establishes fluid communication between a part between the outflow side of the utilization side appliance ( 13, 45 ) and the inflow side of the heat source side appliance ( 11 ) in the circulation pipeline ( 40 ) and a part between the outflow side of the utilization side appliance ( 13, 45 ) and the inflow side of the heat source side appliance ( 11 ) in the circulation pipeline ( 49 ).

Claims

exact text as granted — not AI-modified
1 . A heat conveyance system comprising a heating medium circuit ( 90 ) through which a heating medium flows and configured to convey heat to a utilization side appliance ( 13 ,  45 ) from a heat source side appliance ( 11 ) by the heating medium in the heating medium circuit ( 90 ), the heating medium circuit ( 90 ) comprising: 
 (a) a plurality of circulation pipelines ( 40 ,  49 ) along each of which a heat source side appliance ( 11 ), a utilization side appliance ( 13 ,  45 ), and a pump ( 41 ,  42 ) are provided and each capable of operation to cause the heating medium to circulate between the heat source side appliance ( 11 ) and the utilization side appliance ( 13 ,  45 );    (b) a high temperature side communication pipe ( 91 ) for establishing fluid communication between parts between the outflow sides of the heat source side appliances ( 11 ) and the inflow sides of the utilization side appliances ( 13 ,  45 ) in the plurality of circulation pipelines ( 40 ,  49 ); and    (c) a low temperature side communication pipe ( 92 ) for establishing fluid communication between parts between the outflow sides of the utilization side appliances ( 13 ,  45 ) and the inflow sides of the heat source side appliances ( 11 ) in the plurality of circulation pipelines ( 40 ,  49 ).    
   
   
       2 . The heat conveyance system of  claim 1  wherein: 
 (i) the pump ( 41 ,  42 ) of the circulation pipeline ( 40 ,  49 ) is disposed between the junction of the circulation pipeline ( 40 ,  49 ) with the high temperature side communication pipe ( 91 ) and the inflow side of the utilization side appliance ( 13 ,  45 ); and    (ii) a valve ( 43 ) is disposed between the junction of the circulation pipeline ( 40 ,  49 ) with the high temperature side communication pipe ( 91 ) and the outflow side of the heat source side appliance ( 11 ).    
   
   
       3 . The heat conveyance system of  claim 1  wherein the high temperature side communication pipe ( 91 ) and the low temperature side communication pipe ( 92 ) are provided with a tank ( 97 ) and a tank ( 98 ), respectively.  
   
   
       4 . The heat conveyance system of  claim 1  wherein at least either the high temperature side communication pipe ( 91 ) or the low temperature side communication pipe ( 92 ) is formed in a loop shape and includes a circulation pump ( 93 ,  94 ) for circulating the heating medium.  
   
   
       5 . The heat conveyance system of  claim 1  wherein: 
 (i) the high temperature side communication pipe ( 91 ) and the low temperature side communication pipe ( 92 ) are directly connected together by a bypass pipe ( 96 ) including a bypass pump ( 95 ) for forcing the heating medium in the high temperature side communication pipe ( 91 ) to flow into the low temperature side communication pipe ( 92 ); and    (ii) the bypass pipe ( 96 ) is openable and closable.    
   
   
       6 . The heat conveyance system of  claim 1  wherein: 
 (i) the heating medium circuit ( 90 ) is provided in plural number; and    (ii) the high temperature side communication pipes ( 91 ) of the plural heating medium circuits ( 90 ) are connected to each other and the low temperature side communication pipes ( 92 ) of the plural heating medium circuits ( 90 ) are connected to each other.    
   
   
       7 . The heat conveyance system of  claim 4  wherein: 
 (i) the heating medium circuit ( 90 ) is provided in plural number;    (ii) in each of the plural heating medium circuits ( 90 ) both the high temperature side communication pipe ( 91 ) and the low temperature side communication pipe ( 92 ) are formed in a loop shape; and    (iii) the high temperature side communication pipes ( 91 ) of the plural heating medium circuits ( 90 ) are connected to each other to form a single loop-shaped pipeline ( 191 ) and the low temperature side communication pipes ( 92 ) of the plural heating medium circuits ( 90 ) are connected to each other to form a single loop-shaped pipeline ( 192 ).    
   
   
       8 . The heat conveyance system of  claim 7  wherein (a) the high temperature side communication pipes ( 91 ) of the plural heating medium circuits ( 90 ) are connected to each other by a switch mechanism ( 101 ) which enables switching between a first distribution mode in which the heating medium is allowed to flow only within each of the high temperature side communication pipes ( 91 ) and a second distribution mode in which the heating medium is shared by establishing fluid communication with the high temperature side communication pipe ( 91 ) of the other heating medium circuit ( 90 ) and (b) the low temperature side communication pipes ( 92 ) of the plural heating medium circuits ( 90 ) are connected to each other by a switch mechanism ( 102 ) which enables switching between a first distribution mode in which the heating medium is allowed to flow only within each of the low temperature side communication pipes ( 92 ) and a second distribution mode in which the heating medium is shared by establishing fluid communication with the low temperature side communication pipe ( 92 ) of the other heating medium circuit ( 90 ).

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