Tile back-stamp design and method of manufacture of tile/substrate system

Abstract

A tile has a back-stamp design including a recessed network of channels including intersecting interior channels that traverse in a plurality of directions across the back-stamp design. The perimeter of the back-stamp design is traversed by a raised border, and a plurality of plateaus define the interior channels therebetween. The raised border and the plateaus both extend from the depth of the recessed network of channels to a common outer plane. A plurality of the tiles can be bonded to a substrate to produce a multi-tile panel that can then be installed, e.g., as flooring.

1 . A tile having a back-stamp design comprising:
 a recessed network of channels having a depth and including intersecting interior channels traversing in a plurality of directions across the back-stamp design;   a raised border traversing a perimeter of the back-stamp design and extending to an outer plane from the depth of the recessed network of channels; and   a plurality of plateaus extending to the outer plane from the depth of the recessed network of channels and defining the interior channels therebetween.   
   
   
       2 . The tile of  claim 1 , wherein the raised border and the plateaus extend about 0.5 mm from the depth of the recessed network of channels to the outer plane. 
   
   
       3 . The tile of  claim 1 , wherein the raised border and plateaus proximate to the perimeter define a perimeter channel therebetween. 
   
   
       4 . The tile of  claim 1 , wherein fill areas on the recessed network of channels are positioned between the plateaus and are interlinked via the interior channels. 
   
   
       5 . The tile of  claim 4 , wherein the tile is joined to a substrate with the plateaus and border in contact with the substrate and with the adhesive filling a majority of the recessed network of channels, extending through the interior channels between the fill areas. 
   
   
       6 . The tile of  claim 1 , wherein the tile comprises a ceramic or stone material. 
   
   
       7 . The tile of  claim 1 , wherein the tile comprises porcelain. 
   
   
       8 . The tile of  claim 1 , wherein the tile comprises a man-made material. 
   
   
       9 . The tile of  claim 1 , wherein the plateaus include a pattern of elongated substantially hexagonal shapes, with the interior channels defined between elongated ends of the elongated hexagonal shapes. 
   
   
       10 . The tile of  claim 9 , wherein the plateaus have a width from 0.5 to 2 cm and a length from 1.5 to 4 cm. 
   
   
       11 . The tile of  claim 10 , wherein the plateaus have a width of about 1 cm and a length of about 2.5 cm. 
   
   
       12 . The tile of  claim 10 , wherein the interior channels have a width of no more than five millimeters. 
   
   
       13 . The tile of  claim 1 , wherein the plateaus and interior channels form a repeating pattern across the recessed network of channels, and wherein the pattern is interrupted with gaps across extended regions of the recessed network of channels to enable application of an adhesive thereon. 
   
   
       14 . The tile of  claim 13 , wherein the adhesive applied to the gaps is hot melt. 
   
   
       15 . The tile of  claim 14 , wherein the interior channels traverse across the back-stamp design in orthogonal directions relative to one another. 
   
   
       16 . The tile of  claim 15 , wherein the interior channels traverse across the back-stamp design at acute angles relative to edges of the tile. 
   
   
       17 . The tile of  claim 16 , wherein the acute angles are about 45 degrees relative to the edges of the tile. 
   
   
       18 . The tile of  claim 1 , wherein the plateaus extend from the depth of the recessed network of channels substantially the same distance as the raised border extends. 
   
   
       19 . The tile of  claim 1 , wherein the back-stamp design has an inverse-honeycomb structure. 
   
   
       20 . A method for bonding a tile to a substrate, wherein the tile has a bonding face including a recessed network of channels having a depth from which a raised border and a plurality of plateaus extend, wherein the raised border defines an interior region, wherein the plateaus are within this interior region, and wherein the plateaus define intersecting interior channels therebetween traversing across the back-stamp design in a plurality of directions, the method comprising:
 applying a main adhesive across the bonding face of the tile;   applying a hot-melt adhesive at select locations on the bonding face of the tile; and   placing a substrate in contact with the main adhesive and with the hot melt on the bonding face of the tile and applying a force to the substrate or to the tile to place the substrate in contact with the border and with the plateaus of the bonding face and to distribute the main adhesive through the recessed network of channels.   
   
   
       21 . The method of  claim 20 , wherein a plurality of tiles are bonded to the substrate according to the method of  claim 20 . 
   
   
       22 . The method of  claim 20 , wherein the substrate is secured to the floor of a room to provide a tile surface thereon. 
   
   
       23 . The method of  claim 20 , wherein the substrate is secured to the wall of a room to provide a tile surface thereon. 
   
   
       24 . The method of  claim 20 , wherein the substrate is secured to the ceiling of a room to provide a tile surface suspended therefrom. 
   
   
       25 . A tile/substrate panel comprising:
 a) a substrate;   b) at least one tile having a surface with a back-stamp design comprising:
 a recessed network of channels having a depth and including intersecting interior channels traversing in a plurality of directions across the back-stamp design; 
 a raised border traversing a perimeter of the back-stamp design and extending outward from the depth of the recessed network of channels; and 
 a plurality of plateaus extending from the depth of the recessed network of channels and defining the interior channels therebetween; and 
   c) an adhesive penetrating through the recessed network of channels in the back-stamp design of the tile and securing the tile to the substrate.   
   
   
       26 . The tile/substrate panel of  claim 25 , wherein the tile/substrate system is secured to a floor. 
   
   
       27 . The tile/substrate panel of  claim 25 , wherein the tile/substrate system is secured to a wall. 
   
   
       28 . The tile/substrate panel of  claim 25 , wherein the tile/substrate system is secured to a ceiling. 
   
   
       29 . The tile/substrate panel of  claim 25 , wherein the adhesive comprises a polyurethane resin. 
   
   
       30 . The tile/substrate panel of  claim 25 , wherein the substrate is a backerboard. 
   
   
       31 . The tile/substrate panel of  claim 25 , wherein a plurality of the tiles are secured to one side of the substrate.