US2007254221A1PendingUtilityA1
Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel
Est. expiryDec 24, 2024(expired)· nominal 20-yr term from priority
H10P 14/6922H10P 14/6342H10P 14/44H10P 14/687G03F 7/0757G03F 7/0048G03F 7/0226G03F 7/022G03F 7/0046H10D 86/40H10F 39/026H10D 86/451H10D 86/441H10D 86/60H10P 14/60
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Abstract
A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The surfactant includes an organic fluorine compound having the structure a first silicone compound having the structure a second silicone compound having the structure The resin composition may be used in display panels.
Claims
exact text as granted — not AI-modified1 . A photosensitive resin composition comprising:
an alkali-soluble resin; a quinone diazide; a solvent; and a surfactant that includes:
an organic fluorine compound of structure
where R f is a chained or branched perfluoroalkylene group including about 5-10 carbon atoms and Z is a hydrogen or a fluorine;
a first silicone compound of structure where R is a chained or branched alkylene group including about 2-5 carbon atoms and each of x and y is an integer of about 1-20; and a second silicone compound of structure where R′ is an alkyl group including about 1-20 carbon atoms or a chained or branched carbonyl alkyl group including about 2-21 carbon atoms and each of v and w is an integer of about 1-20, and each of m and 1 is an integer of about 1-9 wherein (m+1) lies between 2 and 10.
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