Rf device with thermo-electric cooler

Abstract

An RF device includes a support structure. An RF electrode is coupled to the support structure and includes conductive and dielectric portions. A thermoelectric cooler is coupled to the support structure and is configured to cool a back surface of the RF electrode.

1 - 33 . (canceled)  
     
     
         34 . A RF device for non-invasively treating tissue using RF energy, the RF device comprising: 
 a support structure;    an RF electrode coupled to the support structure, the RF electrode including a dielectric portion and a conductive portion disposed on the dielectric portion, and the dielectric portion adapted to be positioned between the conductive portion and a skin surface, when the RF electrode is positioned at the skin surface, such that RF energy is capacitively coupled from the conductive portion into the tissue by transmission through the dielectric portion; and    a non-volatile memory mechanically coupled to the RF electrode.    
     
     
         35 - 55 . (canceled)  
     
     
         56 . An RF device for non-invasively treating tissue using RF energy, the RF device comprising: 
 a support structure; and    an RF electrode coupled to the support structure and including a conductive portion and a dielectric portion, the RF electrode configured to capacitively couple RF energy with the tissue when at least a portion of the RF electrode is in contact with a skin surface, the conductive portion including a perimeter and a plurality of voids defined as non-conductive areas within the perimeter, and the dielectric portion adapted to be positioned between the conductive portion and the skin surface when the RF electrode is positioned at the skin surface.    
     
     
         57 . The RF device of  claim 56 , further comprising: 
 a flex circuit coupled to the RF electrode.    
     
     
         58 . The RF device of  claim 56 , further comprising: 
 a backplate back plate coupled to the support structure; and    a plurality of electrical contact pads coupled to the back plate.    
     
     
         59 . The RF device of  claim 56 , wherein the support structure includes first and second engagement members that are configured to provide engagement and disengagement with a handpiece support structure.  
     
     
         60 . The RF device of  claim 56 , further comprising: 
 a sensor coupled to the RF electrode.    
     
     
         61 . The RF device of  claim 60 , wherein the RF electrode has a back surface, and the sensor is positioned at the back surface.  
     
     
         62 . The RF device of  claim 61 , wherein the sensor is configured to detect a temperature of the back surface.  
     
     
         63 . The RF device of  claim 56 , further comprising: 
 a non-volatile memory coupled to the RF electrode.    
     
     
         64 - 83 . (canceled)