Substrate processing apparatus and method

Abstract

A substrate-processing apparatus includes a sample table which mounts thereon a to-be-processed substrate, a first line which supplies a chemical solution, a second line which supplies a cleaning liquid, a three-way valve connected to the first and second lines and configured to select one of the first and second lines, a filter provided across the first line upstream of the three-way valve, and configured to eliminate a foreign material from the chemical solution, and a nozzle provided downstream of the three-way valve and configured to discharge the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve. The three-way valve selects the first line when the substrate is coated with the chemical solution, and selects the second line in other cases.

1 . A substrate-processing apparatus comprising: 
 a sample table which mounts thereon a to-be-processed substrate;    a first line which supplies a chemical solution;    a second line which supplies a cleaning liquid;    a three-way valve connected to the first and second lines and configured to select one of the first and second lines, the three-way valve selecting the first line when the substrate is coated with the chemical solution, and selecting the second line in other cases;    a filter provided across the first line upstream of the three-way valve, and configured to eliminate a foreign material from the chemical solution; and    a nozzle provided downstream of the three-way valve and configured to discharge the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve.    
   
   
       2 . The apparatus according to  claim 1 , wherein the sample table is rotatable.  
   
   
       3 . The apparatus according to  claim 1 , wherein the nozzle is movable between a position corresponding to a center of the substrate and a standby position outside the substrate.  
   
   
       4 . The apparatus according to  claim 3 , wherein the nozzle is cleaned at the standby position by the cleaning liquid supplied, the chemical solution at a tip of the nozzle being purged by the cleaning liquid.  
   
   
       5 . The apparatus according to  claim 1 , wherein, the three-way valve selects the first line to cause the nozzle to discharge the chemical solution onto the substrate when the chemical solution is supplied to the substrate, and selects the second line to fill a portion ranging from the three-way valve to the nozzle with the cleaning liquid after the chemical solution is supplied.  
   
   
       6 . A substrate-processing apparatus comprising: 
 a sample table which mounts thereon a to-be-processed substrate;    a first line which supplies a chemical solution;    a second line which supplies a cleaning liquid;    a first three-way valve connected to the first and second lines and configured to select one of the first and second lines, the first three-way valve selecting the first line when the substrate is coated with the chemical solution, selecting the second line after the chemical solution is supplied, and selecting the first line before the chemical solution is again supplied;    a filter provided across the first line upstream of the three-way valve, and configured to eliminate a foreign material from the chemical solution;    a nozzle provided downstream of the three-way valve and configured to discharge the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve; and    a second three-way valve interposed between the first three-way valve and the nozzle and configured to switch supply of the chemical solution or the cleaning liquid to a nozzle side or to a third line side, the second three-way valve switching the supply to the nozzle side when the chemical solution is supplied onto the substrate, thereby causing the nozzle to discharge the chemical solution onto the substrate, the second three-way valve switching the supply to the nozzle side after the chemical solution is supplied, thereby filling a portion ranging from the first three-way valve to the nozzle with the cleaning liquid, the second three-way valve switching the supply to the third line side before the chemical solution is again supplied, thereby discharging, through the third line, the chemical solution contained in a portion ranging from the filter to the first three-way valve.    
   
   
       7 . The apparatus according to  claim 6 , wherein the second three-way valve switching the supply to the nozzle side immediately before the chemical solution is again supplied, thereby purging, using the chemical solution, the cleaning liquid contained in a portion ranging from the second three-way valve to the nozzle.  
   
   
       8 . The apparatus according to  claim 6 , wherein the sample table is rotatable.  
   
   
       9 . The apparatus according to  claim 6 , wherein the nozzle is movable between a position corresponding to a center of the substrate and a standby position outside the substrate.  
   
   
       10 . The apparatus according to  claim 9 , wherein the nozzle is cleaned at the standby position by the cleaning liquid supplied, the chemical solution at a tip of the nozzle being purged by the cleaning liquid.  
   
   
       11 . A substrate-processing apparatus comprising: 
 a line which supplies a chemical solution onto a to-be-processed substrate; and    a nozzle connected to a tip of the line and configured to discharge the chemical solution onto the substrate, the nozzle having an inner diameter set smaller at a portion of the nozzle located upstream of a distal end thereof than at the distal end, which facilitates sucking back of the chemical solution performed after supply of the chemical solution is stopped.    
   
   
       12 . The apparatus according to  claim 11 , wherein a thin tube is provided in the nozzle to suck the chemical solution at the smaller-diameter portion.  
   
   
       13 . A method for processing a substrate comprising: 
 using a substrate-processing apparatus provided with a first line which supplies a chemical solution, a second line which supplies a cleaning liquid, a three-way valve which selects one of the first and second lines, and a nozzle which discharges the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve;    selecting the first line via the three-way valve when coating the substrate with the chemical solution, thereby causing the nozzle to discharge the chemical solution onto the substrate; and    selecting the second line via the three-way valve in other cases, thereby filling a portion ranging from the three-way valve to the nozzle with the cleaning liquid.