Camera device, method of manufacturing a camera device, wafer scale package

Abstract

The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis through the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.

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       17 . A method for manufacturing a camera device, characterized by the steps of providing a lens substrate comprising a plurality of lens elements, the lens substrate comprising an adhesive layer; stacking the lens substrate and a base substrate comprising a plurality of image capturing elements; aligning the lens substrate and the base substrate along main optical axes through respective lens elements and associated image capturing elements; setting the distance between the lens elements and the associated image capturing elements along the main optical axes through the lens elements and the associated image capturing elements; hardening the adhesive layer; and separating camera devices from the stack of the lens substrate and the base substrate.  
   
   
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       20 . A method of manufacturing a camera device in accordance with  claim 17 , wherein: 
 said adhesive layer comprises an ultra-violet curing resin.    
   
   
       21 . A method of manufacturing a camera device in accordance with  claim 17 , wherein: 
 said adhesive layers comprises a thermo-hardening resin.    
   
   
       22 . A method of manufacturing a camera device in accordance with  claim 17 , including: 
 providing the lens substrate with an infra-red reflecting layer.    
   
   
       23 . A method of manufacturing a camera device in accordance with  claim 17 , including: 
 providing the lens substrate with an anti-reflection layer.    
   
   
       24 . A method of manufacturing a camera device in accordance with  claim 17 , including: 
 providing spacer means between the lens substrate and the base substrate in the form of a spacer substrate, said spacer substrate comprising holes coaxially positioned relative to the main optical axes of the lens elements and the associated image capturing elements.    
   
   
       25 . A method of manufacturing a camera device in accordance with  claim 17 , including: 
 providing spacer means between the lens substrate and the base substrate in the form of a cover substrate, wherein said cover substrate comprises a second lens substrate having a plurality of second lens elements for each projecting an object onto a respective image capturing element, the main optical axes of the lens elements coinciding with the main optical axes of the second lens elements.    
   
   
       26 . A method of manufacturing a camera device in accordance with  claim 17 , wherein: 
 each of the lens elements is of a replication type.    
   
   
       27 . A method of manufacturing a camera device in accordance with  claim 26 , wherein: 
 each lens element is formed as a convexity in the lens substrate.    
   
   
       28 . A method of manufacturing a camera device in accordance with  claim 26 , wherein: 
 each lens element is formed as a concavity in the lens substrate.