Cooler module and heat pipe for cooler module

Abstract

A cooler module includes a heat pipe, which has one end terminating in a heat absorbing section that has at least one pane closely attached to the CPU to absorb heat from the CPU and a relatively greater metal wall thickness than the metal wall thickness of the heat pipe, and a heat sink connected to the other end of the heat pipe for dissipating heat absorbed from the CPU by the heat absorbing section of the heat pipe. The invention also provides a heat pipe for use in such a cooler module.

1 . A cooler module installed in a thermal chip of a computer to dissipate heat from the thermal chip, comprising:
 a heat pipe, said heat pipe formed of a heat conductive metal outer pipe wall and an inner pipe wall formed of a first thermal lining;   a heat sink connected to one end of said heat pipe; and   a tubular heat absorbing section axially extended from one end of said heat pipe opposite to said heat sink and attached to said thermal chip to absorb heat from said thermal chip and to transfer heat from said thermal chip to said heat pipe, said tubular heat absorbing section being formed of a heat conductive metal outer pipe wall and an inner pipe wall formed of a second thermal lining, the heat conductive metal outer pipe wall of said tubular heat absorbing section having a wall thickness greater and outer diameter than the wall thickness and outer diameter of the heat conductive metal outer pipe wall of said heat pipe.   
   
   
       2 . The cooler module as claimed in  claim 1 , wherein the heat conductive metal outer pipe wall of said heat pipe is made of copper. 
   
   
       3 . The cooler module as claimed in  claim 1 , wherein the heat conductive metal outer pipe wall of said tubular heat absorbing section is made of copper. 
   
   
       4 . The cooler module as claimed in  claim 1 , wherein said tubular heat absorbing section has at least one flat bonding surface bonded to said thermal chip. 
   
   
       5 . The cooler module as claimed in  claim 4 , wherein said at least one flat bonding surface is respectively disposed at a bottom side of said tubular heat absorbing member and bonded to a top side of said thermal chip. 
   
   
       6 . The cooler module as claimed in  claim 1 , wherein said heat pipe is a flat pipe. 
   
   
       7 . The cooler module as claimed in  claim 1 , wherein the thermal linings of said heat pipe and said tubular heat absorbing section have one of the powdered, meshed, and grooved structures 
   
   
       8 . A heat pipe being a hollow pipe installed in a computer cooler module, having a first end thereof connected to a heat sink and a second end attached to a thermal chip, said heat pipe having a heat conductive metal outer pipe wall and an inner pipe wall formed of a thermal lining, wherein the second end of said heat pipe that is attached to said thermal chip forms a heat absorbing section, said heat absorbing section having a heat conductive metal outer pipe wall and an inner pipe wall formed of a thermal lining, the heat conductive metal outer pipe wall of said heat absorbing section having a wall thickness and outer diameter greater than the heat conductive metal outer pipe wall of said heat pipe. 
   
   
       9 . The heat pipe as claimed in  claim 8 , wherein the heat conductive metal outer pipe wall of said heat pipe is made of copper. 
   
   
       10 . The heat pipe as claimed in  claim 8 , wherein the heat conductive metal outer pipe wall of said tubular heat absorbing section is made of copper. 
   
   
       11 . The heat pipe as claimed in  claim 8 , wherein said heat pipe is a flat pipe. 
   
   
       12 . The heat pipe as claimed in  claim 8 , wherein said tubular heat absorbing section has at least one flat bonding surface bonded to said thermal chip. 
   
   
       13 . The hear pipe as claimed in  claim 12 , wherein said at least one flat bonding surface is respectively disposed at a bottom side of said tubular heat absorbing section and bonded to a top side of said thermal chip. 
   
   
       14 . The heat pipe as claimed in  claim 8 , wherein the thermal linings of said heat pipe and said tubular heat absorbing section have one of the powdered, meshed, and grooved structures. 
   
   
       15 . A heat pipe being a hollow pipe installed in a computer cooler module, said heat pipe having a first end connected to a heat sink and a second end attached to a thermal chip, wherein the second end of said heat pipe is a heat absorbing section having a wall thickness and outer diameter greater than said heat pipe. 
   
   
       16 . The heat pipe as claimed in  claim 15 , which is made of copper. 
   
   
       17 . The heat pipe as claimed in  claim 15 , wherein said heat absorbing section is made of copper. 
   
   
       18 . The heat pipe as claimed in  claim 15 , which is a flat pipe. 
   
   
       19 . The heat pipe as claimed in  claim 15 , wherein said heat absorbing section has at least one flat bonding surface bonded to said thermal chip. 
   
   
       20 . The cooler module as claimed in  claim 19 , wherein said at least one flat bonding surface is respectively disposed at a bottom side thereof and bonded to a top side of said thermal chip.