Embedded electronic device and method for manufacturing an embedded electronic device

Abstract

An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.

1 . An embedded electronic device comprising:
 a printed circuit board, having a top surface and a bottom surface, wherein a plurality of standoffs are attached to the bottom surface;   a plurality of circuit components attached to the top surface of the printed circuit board;   a bottom overlay attached to the bottom surface of the printed circuit board;   a top overlay positioned above the top surface of the printed circuit board; and   a core layer positioned between the top surface of the printed circuit board and the top overlay and further positioned between the bottom surface of the printed circuit board and the bottom overlay.   
   
   
       2 . The embedded electronic device of  claim 1 , wherein the printed circuit board has a plurality of circuit traces on the top surface configured to operably connect to the plurality of circuit components and may have a plurality of circuit traces on the bottom surface configured to operably connect to a plurality of circuit components on the bottom surface of the printed circuit board. 
   
   
       3 . The embedded electronic device of  claim 2 , wherein the plurality of circuit traces are formed with conductive ink. 
   
   
       4 . The embedded electronic device of  claim 2 , wherein the plurality of circuit traces are etched onto the printed circuit board. 
   
   
       5 . The embedded electronic device of  claim 1 , wherein the plurality of standoffs are arranged in a dot-pattern on the bottom surface of the printed circuit board to allow the core layer to be positioned between the bottom surface of the printed circuit board and the bottom overlay. 
   
   
       6 . The embedded electronic device of  claim 1 , wherein the plurality of standoffs are affixed to the bottom overlay with a pressure sensitive adhesive tape or a spray-on adhesive. 
   
   
       7 . The embedded electronic device of  claim 1 , wherein the plurality of standoffs are copper. 
   
   
       8 . The embedded electronic device of  claim 1 , wherein the printed circuit board is composed of a flame retardant laminate with woven glass reinforced epoxy resin (FR-4). 
   
   
       9 . The embedded electronic device of  claim 1 , wherein the top and bottom overlay are both comprised of polyvinyl chloride. 
   
   
       10 . The embedded electronic device of  claim 1 , wherein the core layer is comprised of thermosetting polyurea. 
   
   
       11 . The embedded electronic device of  claim 1 , wherein one of the plurality of circuit components includes at least one push button. 
   
   
       12 . The embedded electronic device of  claim 1 , wherein one of the plurality of circuit components includes at least one battery. 
   
   
       13 . The embedded electronic device of  claim 1 , wherein one of the plurality of circuit components includes at least one microprocessor chip. 
   
   
       14 . The embedded electronic device of  claim 1 , wherein one of the plurality of circuit components includes at least one speaker. 
   
   
       15 . A method for manufacturing an embedded electronic device, comprising:
 providing a printed circuit board having a top surface and a bottom surface, wherein a plurality of standoffs are attached to the bottom surface;   affixing a plurality of circuit components onto the top surface of the printed circuit board;   affixing the bottom surface of the printed circuit board to a bottom overlay using a pressure sensitive adhesive tape or a spray-on adhesive;   loading the printed circuit board and bottom overlay into an injection molding apparatus;   loading a top overlay positioned above a top surface of the printed circuit board into the injection molding apparatus;   injecting thermosetting polymeric material between the top surface of the printed circuit board, the plurality of circuit components and the top overlay; and   injecting thermosetting polymeric material between the bottom surface of the printed circuit board and the bottom overlay.   
   
   
       16 . The method of  claim 15 , wherein the thermosetting polymeric material is polyurea. 
   
   
       17 . The method of  claim 16 , wherein the plurality of standoffs are arranged in a dot-pattern on the bottom surface of the printed circuit board to allow the polyurea material to be positioned between the bottom surface of the printed circuit board and the bottom overlay. 
   
   
       18 . The method of  claim 15 , wherein a plurality of embedded electronic devices are formed on one printed circuit board. 
   
   
       19 . The method of  claim 15 , further comprising:
 removing the injected top and bottom overlay from the mould; and   cutting out the plurality embedded electronic devices.   
   
   
       20 . The method of  claim 15 , wherein the circuit traces are formed by etching traces into the printed circuit board.