High turbulence heat exchanger

Abstract

The present invention is a method and apparatus for cooling a heat source. In one embodiment a heat exchanger is provided and includes a channel for receiving a coolant, the channel having a first surface and an opposing second surface. A mesh plug is disposed in the channel for turbulently mixing the coolant within the channel. The first surface of the channel is disposed proximate a semiconductor heat source. In one embodiment the first surface comprises plastic. In one embodiment, the second surface comprises metal, for example, copper. In one embodiment the mesh plug comprises a nickel-coated copper mesh.

1 . A method of cooling a semiconductor heat source device, comprising: 
 providing a heat exchanger having a channel for receiving a coolant, the channel having a first surface, an opposing second surface, and a mesh plug disposed therebetween for turbulently mixing the coolant within the channel, wherein the first surface of the channel is disposed proximate the semiconductor heat source, the semiconductor heat source being: an integrated circuit chip, a portion of an integrated circuit chip, a plurality of integrated circuit chips, or a circuit board;    providing an aperture formed through the first surface for receiving the semiconductor heat source therein such that the semiconductor heat source is placed in direct contact with the mesh plug; and    flowing a coolant through the channel.    
   
   
       2 . The method of  claim 1 , further comprising: 
 recirculating the coolant through the channel using a pump.    
   
   
       3 . The method of  claim 1 , wherein the coolant comprises at least one of: water, a water-based liquid, glycol, ethylene glycol, propylene glycol, oil, hydrocarbon, hydrocarbon blends, alcohol, methyl bis(phenylmethyl)-benzene, sodium chloride, and silicone.  
   
   
       4 . The method of  claim 1 , wherein the coolant is a liquid with a freezing point below that of water.  
   
   
       5 . The method of  claim 1 , wherein the coolant is a liquid metal.  
   
   
       6 . The method of  claim 5 , wherein the liquid metal comprises at least one of: mercury, gallium, indium, tin, and bismuth.