Apparatus and method of fabricating thin film pattern

Abstract

A fabricating method and apparatus of a thin film pattern improves the reliability of forming the thin film pattern by a resist printing method. The apparatus includes a print roller device of a roll shape around which a blanket is wound; a spray device located around the print roller device for spraying an etch resist solution to the blanket; and a print plate of an engraved shape where a groove of a desired thin film shape and a projected part except the groove are formed, and the etch resist solution has a surfactant inclusive of an ethylene oxide fluorinated polymer material.

1 . A fabricating apparatus of a thin film pattern, comprising:
 a print roller device having a roll shape around which a blanket is wound;   a spray device located around the print roller device for spraying an etch resist solution onto the blanket; and   a print plate of an engraved shape where a groove of a desired thin film shape and a projected part except the groove are formed, and   wherein the etch resist solution includes at least one surfactant inclusive of an ethylene oxide fluorinated polymer.   
     
     
         2 . The fabricating apparatus according to  claim 1 , wherein the ethylene oxide fluorinated polymer has the general formula CF 3 (CF 2 ) m (CH 2 CH 2 O) n  where m is about 1-10 and n is about 8-50. 
     
     
         3 . The fabricating apparatus according to  claim 1 , wherein the ethylene oxide fluorinated polymer is CF 3 (CF 2 ) 4 (CH 2 CH 2 0) 10  or CF 3 (CF 2 ) 5 (CH 2 CH 2 0) 14 . 
     
     
         4 . The fabricating apparatus according to  claim 1 , wherein the etch resist solution has a base polymer of 4˜20%, a carrier solvent of 40˜60%, a printing solvent of 20˜40% and the surfactant of 0.05˜1%. 
     
     
         5 . The fabricating apparatus according to  claim 1 , wherein the surfactant has molecular structures of hydrocarbons and fluorine radicals, and the molecules of the hydrocarbons and fluorine radicals are randomly distributed within the etch resist solution. 
     
     
         6 . The fabricating apparatus according to  claim 5 , wherein the hydrocarbon group molecule is at least any one of ethylene oxide (CH 2 CH 2 O), propylene oxide (CH 2 CH 2 CH 2 O) or amine (CH 2 N). 
     
     
         7 . The fabricating apparatus according to  claim 5 , wherein an adhesive force between the etch resist solution and the print plate is stronger than an adhesive force between the etch resist solution and the blanket. 
     
     
         8 . The fabricating apparatus according to  claim 4 , wherein the base polymer is any one of novolac, poly methyl methacrylate or poly methyl acrylate. 
     
     
         9 . The fabricating apparatus according to  claim 4 , wherein the carrier solvent is at least one alcohol. 
     
     
         10 . The fabricating apparatus according to  claim 4 , wherein the printing solvent is at least any one of N-Methyl pyrrolidone, ethyl benzoate or tri-isopropyl benzene. 
     
     
         11 . A fabricating method of a thin film pattern, comprising:
 providing a print roller device having a roll shape around which a blanket is wound;   coating the blanket with an etch resist solution including a surfactant inclusive of an ethylene oxide fluorinated polymer;   providing a print plate of an engraved shape where a groove and a projected part except the groove is formed; and   transferring the etch resist solution only on the projected part of the print plate and leaving the etch resist solution of an area corresponding to the groove in the print roller device.   
     
     
         12 . The fabricating method according to  claim 11 , wherein the ethylene oxide fluorinated polymer has the general formula CF 3 (CF 2 ) m (CH 2 CH 2 O) n  where m is about 1-10 and n is about 8-50. 
     
     
         13 . The fabricating method according to  claim 11 , wherein the ethylene oxide fluorinated polymer is any one of CF 3 (CF 2 ) 4 (CH 2 CH 2 0) 10  or CF 3 (CF 2 ) 5 (CH 2 CH 2 0) 14 . 
     
     
         14 . The fabricating method according to  claim 11 , wherein the etch resist solution has a base polymer of 4˜20%, a carrier solvent of 40˜60%, a printing solvent of 20˜40% and the surfactant of 0.05˜1%. 
     
     
         15 . The fabricating method according to  claim 11 , wherein the surfactant has molecular structures of hydrocarbons and fluorine radicals, and the molecules of the hydrocarbons and fluorine radicals are randomly distributed within the etch resist solution. 
     
     
         16 . The fabricating method according to  claim 15 , wherein the hydro carbon molecules are at least one of ethylene oxide, propylene oxide or amine. 
     
     
         17 . The fabricating method according to  claim 11 , wherein an adhesive force between the etch resist solution and the print plate is stronger than an adhesive force between the etch resist solution and the blanket. 
     
     
         18 . The fabricating method according to  claim 14 , wherein the base polymer is any one of novolac, poly methyl methacrylate or poly methyl acrylate. 
     
     
         19 . The fabricating method according to  claim 14 , wherein the carrier solvent is at least one alcohol. 
     
     
         20 . The fabricating method according to  claim 14 , wherein the printing solvent is at least any one of N-Methyl pyrrolidone, ethyl benzoate or tri-isopropyl benzene. 
     
     
         21 . The fabricating method according to  claim 11 , wherein transferring the etch resist solution onto the projected part of the print plate further includes:
 contacting the etch resist solution with the surface of the projected part while rotating the print roller device which is coated with the etch resist solution.   
     
     
         22 . The fabricating method according to  claim 11 , further comprising:
 providing a substrate where a thin film layer is formed; and   transferring the etch resist solution left in the print roller device onto the thin film layer to form the etch resist of the same shape as a groove of the print plate onto the thin film layer.   
     
     
         23 . An etch resist solution, comprising:
 a base polymer;   a printing solvent;   a carrier solvent; and   a surfactant inclusive of an ethylene oxide fluorinated polymer.   
     
     
         24 . The etch resist solution according to  claim 23 , wherein the ethylene oxide fluorinated polymer has the general formula CF 3 (CF 2 ) m (CH 2 CH 2 O) n  where m is about 1-10 and n is about 8-50. 
     
     
         25 . The etch resist solution according to  claim 23 , wherein the ethylene oxide fluorinated polymer is CF 3 (CF 2 ) 4 (CH 2 CH 2 0) 10  or CF 3 (CF 2 ) 5 (CH 2 CH 2 0) 14 . 
     
     
         26 . The etch resist solution according to  claim 23 , wherein the base polymer of is present at 4˜20%, the carrier solvent is present at 40˜60%, the printing solvent is present at 20˜40% and the surfactant is present at 0.05˜1%.