Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embedded Conductive Material

Abstract

Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.

1 . A micro-fluid ejection device comprising a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer wherein the polymeric layer comprises at least two layers of polymeric material. 
     
     
         2 . The micro-fluid ejection device of  claim 1 , wherein the polymeric layer comprises multiple photoresist layers. 
     
     
         3 . The micro-fluid ejection device of  claim 1 , wherein the conductive layer comprises an electroplated conductive layer. 
     
     
         4 . The micro-fluid ejection device of  claim 1 , wherein the conductive layer comprises a printed conductive layer. 
     
     
         5 . The micro-fluid ejection device of  claim 1 , wherein the polymeric layer comprises a nozzle plate. 
     
     
         6 . The micro-fluid ejection device of  claim 1 , wherein the polymeric layer comprises a thick film layer. 
     
     
         7 . The micro-fluid ejection device of  claim 1 , wherein the polymeric layer comprises a combination of a nozzle plate and a thick film layer. 
     
     
         8 . The micro-fluid ejection device of  claim 1 , wherein the conductive layer is selected from the group consisting of copper, gold, aluminum, and silver. 
     
     
         9 . A method for making a micro-fluid ejection head comprising:
 depositing a first polymeric material for a polymeric layer adjacent a substrate;   imaging and developing the first polymeric material;   depositing a conductive material adjacent at least a portion of the first polymeric material to provide a conductive path for electrical communication with an electrical signal source; and   depositing at least a second polymeric material for the polymeric layer adjacent the first polymeric material and conductive material to provide the conductive path embedded in the polymeric layer.   
     
     
         10 . The method of  claim 9 , wherein depositing a first polymeric material comprises depositing a photoresist material. 
     
     
         11 . The method of  claim 10 , wherein depositing at least a second polymeric material comprises depositing a polyimide material. 
     
     
         12 . The method of  claim 9 , wherein the conductive material is deposited by a process selected from the group consisting of electroplating, film etching, low temperature sputtering, and printing. 
     
     
         13 . The method of  claim 9  wherein the polymeric layer comprises a nozzle plate comprising at least two nozzle plate layers. 
     
     
         14 . The method of  claim 9 , wherein the polymeric layer comprises a thick film layer and a nozzle plate. 
     
     
         15 . The method of  claim 9 , wherein depositing a conductive material comprises depositing a material selected from the group consisting of copper, gold, aluminum, and silver. 
     
     
         16 . The method of  claim 9 , depositing a first polymeric material adjacent a substrate comprises depositing a first polymeric material adjacent a substrate comprising a fluid flow slot therethrough and wherein the conductive path provided crosses over the fluid flow slot in the polymeric layer. 
     
     
         17 . A method for reducing a size of a substrate for a micro-fluid ejection head comprising:
 depositing a first polymeric material for a polymeric layer adjacent a substrate;   imaging and developing the first polymeric material;   depositing an electrical component selected from the group consisting of electrical traces, capacitors, anti-fuse devices, and the like adjacent the first polymeric material; and   depositing at least a second polymeric material for the polymeric layer adjacent the first polymeric material and the electrical component to provide the electrical component embedded in the polymeric layer.   
     
     
         18 . The method of  claim 17 , wherein depositing the polymeric materials comprises depositing photoresist materials. 
     
     
         19 . The method of  claim 17 , wherein depositing a second polymeric material comprises depositing a polyimide material. 
     
     
         20 . The method of  claim 17 , wherein depositing an electrical component comprises depositing an electrical component by a process selected from the group consisting of electroplating, film etching, low temperature sputtering, and printing.