Solder cooling system

Abstract

A system for processing a substrate having solder bumps includes a first region having a first pressure and adapted to receive the substrate for heating; a second region having a second pressure greater than the first pressure and adapted to receive the substrate for cooling; a support member constructed and arranged for supporting the substrate in the first region and the second region, the support member adapted to conductively cool the substrate disposed thereon; and a spray assembly disposed in the second region for providing a cooling spray to the second region and the substrate.

1 . A system for processing a substrate having solder bumps comprising: 
 a first region having a first pressure and adapted to receive the substrate for heating;    a second region having a second pressure greater than the first pressure and adapted to receive the substrate for cooling;    support means constructed and arranged for supporting the substrate in the first region and the second region, the support means adapted to conductively cool the substrate disposed thereon; and    spray means disposed in the second region for providing a spray of a cooling medium to the second region and the substrate.    
   
   
       2 . The system according to  claim 1 , further comprising exhaust means in communication with at least one of the first region and the second region.  
   
   
       3 . The system according to  claim 1 , wherein the support means comprises a longitudinal member having a cooling zone for conductively cooling the substrate.  
   
   
       4 . The system according to  claim 3 , wherein the cooling zone comprises a cavity formed in the longitudinal member for receiving a cooling medium selected from water, other fluids and combination thereof.  
   
   
       5 . The system according to  claim 1 , further comprising: a first chamber for containing the first region and having a sealable inlet associated therewith; a second chamber for containing the second region and having a sealable outlet associated therewith; and a sealable passageway interconnecting the first and second chambers and through which the substrate is transferred between the first and second chambers.  
   
   
       6 . The system according to  claim 1 , wherein the spray means is disposed above the support means.  
   
   
       7 . The system according to  claim 6 , wherein the spray means comprises a plurality of jet spray nozzles.  
   
   
       8 . The system according to  claim 1 , wherein the cooling medium is selected from carbon dioxide, nitrogen, hydrogen, and combinations thereof.  
   
   
       9 . The system according to  claim 1 , wherein the support means comprises retaining members for releasably retaining the substrate positioned on the support means during exposure to the spray means.  
   
   
       10 . The system according to  claim 9 , wherein the retaining means comprises projections constructed and arranged to releasably receive and position the substrate for being subjected to the spray means.  
   
   
       11 . The system according to  claim 1 , wherein the second pressure is from 100 Torr up to 1 atmosphere.  
   
   
       12 . The system according to  claim 5 , further comprising a passageway door constructed and arranged at the first chamber and the second chamber to control movement of the substrate between the first and second chambers and to segregate an atmosphere of the first region from an atmosphere of the second region.  
   
   
       13 . The system according to  claim 1 , further comprising a gas conduit having one end in communication with the spray means and another end in communication with a source of the cooling medium.  
   
   
       14 . The system according to  claim 1 , further comprising a pressure differential assembly in communication with the first and second regions for providing a vacuum therein for facilitating retaining the substrate on the support means.  
   
   
       15 . The system according to  claim 7 , wherein the plurality of jet spray nozzles are disposed above and below the support means.  
   
   
       16 . A system for processing a substrate having solder bumps comprising: 
 a first region having a first pressure and adapted to receive the substrate for heating;    a second region having a second pressure greater than the first pressure and adapted to receive the substrate for cooling;    cooling means constructed and arranged for cooling the substrate by conduction and spray means for providing a spray of a cooling medium to the second region and the substrate.    
   
   
       17 . A method of processing a substrate having solder bumps, comprising: 
 heating the substrate at a first pressure; and    cooling the substrate at a second pressure greater than the first pressure, the cooling by conduction and by convection cooling jets.    
   
   
       18 . The method according to  claim 17 , wherein the convection cooling jets are provided from above the substrate.  
   
   
       19 . The method according to  claim 17 , wherein the convection cooling jets are provided from above and below the substrate.  
   
   
       20 . The method according to  claim 17 , further comprising providing a pressure differential proximate the substrate to stabilize the substrate during exposure to the convection cooling jets.  
   
   
       21 . The method according to  claim 17 , further comprising exhausting atmosphere proximate the substrate after the heating and cooling steps.