Assemblies useful for the preparation of electronic components and methods for making same

Abstract

In accordance with the present invention, assemblies have been developed which are useful for a variety of applications, e.g., in RF applications where low electrical loss products are desirable, e.g., in cellular communications, RF antennas, satellite communications, radar, power amplifiers, high speed digital applications, laminate-based chip carriers, and the like. Invention assemblies comprise a combination of a first reinforced thermoplastic-containing layer and a first non-reinforced thermoplastic-containing layer, wherein the reinforced and non-reinforced thermoplastic-containing layers are capable of forming a bond (e.g., a cohesive or adhesive bond) therebetween, thereby providing performance properties (e.g., electrical performance and cladding bond strength) that are superior to the performance properties of either material alone. The reinforced thermoplastic-containing layer can include a porous substrate impregnated with a composition comprising: a first component (i.e., a low loss, low dielectric constant, hydrocarbyl thermoplastic), a second component (i.e., a component able to crosslink and produce a thermoset in the presence of the first component), and a free radical source. Also provided in accordance with the present invention are methods for preparing the above-described assemblies.

1 . An assembly comprising:
 a first reinforced thermoplastic-containing layer, and   a first non-reinforced thermoplastic layer,   wherein the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer are capable of interacting sufficiently so as to form a bond therebetween,   wherein said first reinforced thermoplastic-containing layer comprises a porous substrate impregnated with a composition comprising:   (a) a first component comprising a low loss, low dielectric constant, hydrocarbyl thermoplastic resin,   (b) a second component which is capable of crosslinking to produce a thermoset in the presence of the first component,   (c) a free radical source,   (d) optionally, one or more additives, and   (e) an optional diluent therefore,   
       wherein the resulting impregnated substrate has been subjected, if necessary, to conditions suitable to remove substantially all of the optionally present diluent therefrom. 
     
     
         2 . An assembly according to  claim 1  wherein the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer have compatible melt solubility. 
     
     
         3 . An assembly according to  claim 1  wherein the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer are capable of forming an adhesive bond therebetween. 
     
     
         4 . An assembly according to  claim 1  wherein the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer are capable of forming a mechanical bond therebetween. 
     
     
         5 . An assembly according to  claim 1  wherein the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer interact sufficiently to produce an interlayer peel strength of at least about four pounds per linear inch. 
     
     
         6 . An assembly according to  claim 1  wherein said porous substrate is woven or non-woven. 
     
     
         7 . An assembly according to  claim 1  wherein said porous substrate is selected from the group consisting of woven glass, non-woven glass, woven aramid fibers, non-woven aramid fibers, woven liquid crystal polymer fibers, non-woven liquid crystal polymer fibers, woven synthetic polymer fibers, non-woven synthetic polymer fibers, randomly dispersed fiber reinforcements, expanded PTFE structures and combinations of any two or more thereof. 
     
     
         8 . An assembly according to  claim 1  wherein said porous substrate is selected from the group consisting of fiberglass, quartz, polyester fiber, polyamide fiber, polyphenylene sulfide fiber, polyetherimide fiber, cyclic olefin copolymer fiber, polyalkylene fiber, liquid crystalline polymer, poly(p-phenylene-2,6-benzobisoxazole), and mixtures of any two or more thereof. 
     
     
         9 . An assembly according to  claim 1  wherein said porous substrate is of glass formulation types E, S, C, or D. 
     
     
         10 . An assembly according to  claim 1  wherein said porous substrate is selected from the group consisting of aramid fiber, polytetrafluoroethylene, a copolymer of tetrafluoroethylene and perfluoromethylvinyl ether (MFA). 
     
     
         11 . An assembly according to  claim 1 , further comprising one or more additional reinforced thermoplastic-containing layer(s). 
     
     
         12 . An assembly according to  claim 1  wherein said first non-reinforced thermoplastic layer has a thickness of at least about 10 microns. 
     
     
         13 . An assembly according to  claim 1  wherein said non-reinforced thermoplastic layer comprises a thermoplastic resin selected from the group consisting of cyclic olefin copolymer, terpolymers, block copolymers, or combinations of any two or more thereof. 
     
     
         14 . An assembly according to  claim 13  wherein said non-reinforced thermoplastic resin is selected from the group consisting of cyclic olefin copolymers, polyetherimides, polyether ether ketones (PEEKs), liquid crystal polymers (LCPs), polytetrafluoroethlyene, polyphenylenesulfide, polyphenyleneoxide, polyphenylene ether, polymethylpentene (TPX), polypropylene, and polyethylene. 
     
     
         15 . An assembly according to  claim 1  wherein said non-reinforced thermoplastic layer contains one or more inorganic or organic fillers. 
     
     
         16 . An assembly according to  claim 1  wherein said filler is selected from the group consisting of ceramics, fused silica, glass bubbles, glass spheres, glass powder, polymeric spheres, polymeric bubbles, aluminum nitride, boron nitride, silicon carbide, diamond, graphite, beryllium oxide, magnesia, silica, titanium oxide, strontium oxide, perfluorinated hydrocarbon polymers, thermoplastic polymers, thermoplastic elastomers, mica, aluminum oxide, cordierite, steatite, barium titanate, magnesium titanate, and neodymium titanate. 
     
     
         17 . An assembly according to  claim 1  wherein said non-reinforced thermoplastic layer contains one or more inorganic or organic micro-fibers selected from the group consisting of glass, quartz, aramid, carbon fiber, and polytetrafluoroethlyene. 
     
     
         18 . An assembly according to  claim 11 , further comprising one or more additional non-reinforced thermoplastic layer(s). 
     
     
         19 . An assembly according to  claim 1  further comprising a first conductive layer. 
     
     
         20 . An assembly according to  claim 19  wherein said first conductive layer is electrically conductive. 
     
     
         21 . An assembly according to  claim 20  wherein said first electrically conductive layer is copper or an alloy thereof, nickel or an alloy thereof, nickel or nickel alloy plated copper, rolled copper-invar-copper, aluminum, or a combination of any two or more thereof. 
     
     
         22 . An assembly according to  claim 20  wherein said first electrically conductive layer is copper or an alloy thereof. 
     
     
         23 . An assembly according to  claim 20  wherein said first electrically conductive layer is capable of being converted into frequency dependent circuitry. 
     
     
         24 . An assembly according to  claim 19 , further comprising a second conductive layer. 
     
     
         25 . An assembly according to  claim 24  wherein said second conductive layer is electrically conductive. 
     
     
         26 . An assembly according to  claim 25  wherein said second electrically conductive layer is copper or an alloy thereof, nickel or an alloy thereof, nickel or nickel alloy plated copper, rolled copper-invar-copper, aluminum, or a combination of any two or more thereof. 
     
     
         27 . An assembly according to  claim 25  wherein said second electrically conductive layer is copper or an alloy thereof. 
     
     
         28 . An assembly according to  claim 24  wherein said second conductive layer defines a ground plane. 
     
     
         29 . An assembly according to  claim 1  wherein the assembly has a dielectric constant of between about 2.0 to about 4.5. 
     
     
         30 . A laminate comprising:
 a first reinforced thermoplastic-containing layer, and   a first non-reinforced thermoplastic layer,   wherein the reinforced thermoplastic-containing layer and the non-reinforced thermoplastic layer are capable of interacting sufficiently so as to form a bond therebetween,   wherein said first reinforced thermoplastic-containing layer comprises a porous substrate impregnated with a composition comprising:   (a) a first component comprising a low loss, low dielectric constant, hydrocarbyl thermoplastic resin,   (b) a second component which is capable of crosslinking to produce a thermoset in the presence of the first component,   (c) a free radical source,   (d) optionally, one or more additives, and   (e) an optional diluent therefore,   
       wherein the resulting impregnated substrate has been subjected, if necessary, to conditions suitable to remove substantially all of the optionally present diluent therefrom. 
     
     
         31 . A laminate according to  claim 30  further comprising a first conductive layer. 
     
     
         32 . A laminate according to  claim 31  further comprising a second conductive layer. 
     
     
         33 . A method for preparing a laminate according to  claim 30 , said method further comprising subjecting a stack comprising said first reinforced thermoplastic-containing layer and said first non-reinforced thermoplastic layer to conditions suitable to cure the thermoset component of said reinforced thermoplastic-containing layer, and cause the thermoplastic component of said reinforced thermoplastic-containing layer and said non-reinforced thermoplastic layer to form a bond therebetween. 
     
     
         34 . A method according to  claim 33  wherein said conditions are sufficient to cause the thermoplastic component of said reinforced thermoplastic-containing layer to flow and said non-reinforced thermoplastic layer to soften sufficiently so as to permit molecular miscibility between each of the layers sufficient to form said bond therebetween. 
     
     
         35 . A method according to  claim 33  wherein each of said layers are provided in continuous lengths. 
     
     
         36 . A method according to  claim 35  wherein the resulting assembly is thereafter cut into the desired size and/or shape. 
     
     
         37 . A method for preparing a laminate according to  claim 31 , said method comprising subjecting a stack comprising said first conductive layer, said first reinforced thermoplastic-containing layer, and said first non-reinforced thermoplastic layer to conditions suitable to cure the thermoset component of said reinforced thermoplastic-containing layer, and cause the thermoplastic component of said reinforced thermoplastic-containing layer and said non-reinforced thermoplastic layer to form a bond therebetween. 
     
     
         38 . A method for preparing a laminate according to  claim 32 , said method comprising subjecting a stack comprising said first conductive layer, said first reinforced thermoplastic-containing layer, said first non-reinforced thermoplastic layer, a second reinforced thermoplastic-containing layer, and said second conductive layer to conditions suitable to cure the thermoset component of said reinforced thermoplastic-containing layer, and cause the thermoplastic component of said reinforced thermoplastic-containing layers and said non-reinforced thermoplastic layer(s) to form a bond therebetween. 
     
     
         39 . A method for preparing an article useful for the formation of frequency dependent circuitry, said method comprising subjecting an assembly according to  claim 24  to processing suitable to create circuitry on the first conductive layer and/or a ground plane on the second conductive layer of said assembly. 
     
     
         40 . A method according to  claim 39  wherein said the resulting article containing frequency dependent circuitry defines a high frequency or digital device. 
     
     
         41 . A method according to  claim 39  wherein a plurality of circuits are created on the first conductive layer. 
     
     
         42 . A method according to  claim 39  further comprising a plurality of circuits applied to said first conductive layer. 
     
     
         43 . A method according to  claim 39  further comprising applying the resulting assembly to a suitable substrate. 
     
     
         44 . A method for preparing an article useful for the formation of frequency dependent circuitry, said method comprising subjecting a laminate according to  claim 32  to processing suitable to create circuitry on the first conductive layer and/or a ground plane on the second conductive layer of said laminate. 
     
     
         45 . A stacked assembly comprising a plurality of assemblies according to  claim 1 .