Methods and apparatus for passive attachment of components for integrated circuits

Abstract

Methods and apparatus provide a sensor having an integrated component coupled to a leadframe. In one embodiment, a sensor includes external leads on an opposite side of a die from the integrated component. In another embodiment, a leadframe includes a slot to reduce eddy currents.

1 . A sensor, comprising:
 a die;   a leadframe having opposed first and second surfaces, the leadframe supporting the die on the first surface;   lead fingers to provide electrical connections to the leadframe and to the die; and   a component coupled to the leadframe and to a first one of the lead fingers such that the component is an integrated part of the IC package.   
   
   
       2 . The sensor according to  claim 1 , wherein the leadframe has a cutout region in which the component is positioned. 
   
   
       3 . The sensor according to  claim 1 , wherein a bottom surface of the component is below the second surface of the leadframe. 
   
   
       4 . The sensor according to  claim 3 , wherein the component is generally centered about a longitudinal axis of the leadframe such that substantially equal portions of the component are above the first surface and below the second surface. 
   
   
       5 . The sensor according to  claim 1 , wherein the sensor comprises a magnetic sensor. 
   
   
       6 . The sensor according to  claim 5 , wherein the component includes a capacitor. 
   
   
       7 . The sensor according to  claim 5 , wherein the leadframe includes at least one slot to reduce eddy currents. 
   
   
       8 . The sensor according to  claim 5 , wherein the magnetic sensor includes a Hall element. 
   
   
       9 . The sensor according to  claim 5 , wherein the magnetic sensor includes one or more of a Hall element, an AMR element, and/or a GMR element. 
   
   
       10 . The sensor according to  claim 1 , wherein the sensor includes external leads such that the external leads are on an opposite side of the die as the component coupled to the leadframe. 
   
   
       11 . The sensor according to  claim 10 , wherein the component includes a capacitor. 
   
   
       12 . The sensor according to  claim 10 , further including a second component on the opposite side of die as the external leads. 
   
   
       13 . The sensor according to  claim 10 , wherein the lead frame includes at least one slot to reduce eddy currents. 
   
   
       14 . The sensor according to  claim 13 , wherein the sensor includes a Hall element. 
   
   
       15 . The sensor according to  claim 1 , wherein the lead frame includes at least one slot to reduce eddy currents. 
   
   
       16 . The sensor according to  claim 15 , wherein the sensor includes a Hall element aligned with the at least one slot. 
   
   
       17 . The sensor according to  claim 16 , wherein the at least one slot includes first, second and third slots, wherein the first slot is aligned with the Hall element and the second and third slots are symmetrical with respect to the Hall element.