Led lamp

Abstract

An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

1 . An LED lamp comprising: 
 a substrate;    at least one LED chip flip-chip bonded to the substrate;    a cylindrically-shaped resin portion, which covers the LED chip and which includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission; and    a reflective member having at least one opening in which the resin portions is positioned,    wherein the upper surface of the resin portion is substantially flat, and the resin portion has at least one side surface separated from a side surface of the opening of the reflective member.    
   
   
       2 . The LED lamp of  claim 1 , wherein a plurality of the LED chips are bonded to the substrate, and the plurality of LED chips are covered with the resin portion.  
   
   
       3 . The LED lamp of  claim 1 , wherein the LED lamp is designed so as to satisfy 0.02 mm≦h≦0.1 mm and 0.15 mm≦x≦0.5 mm, where h is a distance between the upper surface of the resin portion including the phosphor and an upper surface of the LED chip and x is a distance between the at least one side surface of the resin portion including the phosphor and at least one side surface of the LED chip.  
   
   
       4 . The LED lamp of  claim 1 , wherein the phosphor is a non-YAG-based substance, and wherein if h exceeds 0.1 mm, then the LED lamp satisfies 0.47≦h/x≦1.82, where h is a distance between the upper surface of the resin portion including the phosphor and an upper surface of the LED chip and x is a distance between the at least one side surface of the resin portion including the phosphor and at least one side surface of the LED chip.  
   
   
       5 . The LED lamp of  claim 1 , wherein the resin portion including the phosphor is made of a silicone resin, and 
 wherein the phosphor has a mean particle size of 3 μm to 15 μm and has a greater specific gravity than the silicone resin, and    wherein the LED lamp satisfies 0.2≦h/x≦0.5, where h is a distance between the upper surface of the resin portion including the phosphor and an upper surface of the LED chip and x is a distance between the at least one side surface of the resin portion including the phosphor and at least one side surface of the LED chip.    
   
   
       6 . The LED lamp of  claim 5 , wherein a resin portion including the phosphor includes particles of a thixo agent, of which a mean particle size is less than 1 μm.