System and method for housing power supplies for an electronic device

Abstract

A housing for an electronic device has a first volume bounded by a first face and a second volume bounded by a second face. The second face is indented from the first face. A plurality of electronic components are housed in the first volume, and one or more power supplies are housed in the second volume. The electronic components are operable to be powered by a coupling to the one or more power supplies, the coupling running between the indented second face and the first face.

1 - 38 . (canceled)  
     
     
         39 . An electronic device comprising: 
 a modular first housing enclosing one or more electronic components;    a modular second housing coupled to the first housing, the second housing enclosing one or more power supplies, the first housing overhanging the second housing, thereby defining an overhang region between the first and second housings; and    one or more power supply cords coupled between the one or more power supplies and the one or more electronic components, the one or more power supply cords extending through the overhang region.    
     
     
         40 . The device of  claim 39  wherein the first housing is higher than the second housing.  
     
     
         41 . The device of  claim 39  wherein the first housing is lower than the second housing.  
     
     
         42 . The device of  claim 39  the one or more power supplies comprises a plurality of power supplies.  
     
     
         43 . The device of  claim 42  wherein at least two of the power supplies are disposed in separate sub-housings of the second housing, separated by a structure disposed within the second housing.  
     
     
         44 . The device of  claim 39  the one or more electronic components comprises a plurality of electronic components.  
     
     
         45 . An electronic device comprising: 
 a modular first housing for enclosing one or more electronic components;    a modular second housing coupled to the first housing, the second housing for enclosing one or more power supplies, the first housing overhanging the second housing, thereby defining an overhang region between the first and second housings; and    one or more power supply cords for coupling between the one or more power supplies and the one or more electronic components, the one or more power supply cords extending through the overhang region.    
     
     
         46 . The device of  claim 45  wherein the first housing is higher than the second housing.  
     
     
         47 . The device of  claim 45  wherein the first housing is lower than the second housing.  
     
     
         48 . The device of  claim 45  the one or more power supplies comprises a plurality of power supplies.  
     
     
         49 . The device of  claim 48  wherein at least two of the power supplies are disposed in separate sub-housings of the second housing, separated by a structure disposed within the second housing.  
     
     
         50 . The device of  claim 45  the one or more electronic components comprises a plurality of electronic components.  
     
     
         51 . An electronic device comprising: 
 a modular first housing for enclosing one or more electronic components; and    a modular second housing coupled to the first housing, the second housing for enclosing one or more power supplies, the first housing overhanging the second housing and thereby defining an overhang region between the first and second housings for extending one or more power supply cords therein, thereby coupling between the one or more power supplies and the one or more electronic components.    
     
     
         52 . The device of  claim 51  wherein the first housing is higher than the second housing.  
     
     
         53 . The device of  claim 51  wherein the first housing is lower than the second housing.  
     
     
         54 . The device of  claim 51  the one or more power supplies comprises a plurality of power supplies.  
     
     
         55 . The device of  claim 54  wherein at least two of the power supplies are disposed in separate sub-housings of the second housing, separated by a structure disposed within the second housing.  
     
     
         56 . The device of  claim 51  the one or more electronic components comprises a plurality of electronic components.