Circuit board with cooling function

Abstract

The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.

1 . A manufacturing process of a circuit board with a cooling function, comprising:
 forming a thermal interface layer on a first metal thin layer of a thermal plate;   joining a second metal thin layer of a main circuit board comprising at least one opening with the thermal interface layer; and   reflowing the main circuit board with the joined thermal plate.   
   
   
       2 . The manufacturing process of the circuit board with a cooling function of  claim 1 , further comprises forming the first metal thin layer on a surface of the thermal plate. 
   
   
       3 . The manufacturing process of the circuit board with a cooling function of  claim 1 , wherein the thermal interface layer is a solder paste. 
   
   
       4 . The manufacturing process of the circuit board with a cooling function of  claim 1 , wherein the material of the first metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead. 
   
   
       5 . The manufacturing process of the circuit board with a cooling function of  claim 1 , wherein the material of the second metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead. 
   
   
       6 . The manufacturing process of the circuit board with a cooling function of  claim 1 , further comprises disposing at least one electronic component on the opening of the main circuit board prior to the reflowing. 
   
   
       7 . The manufacturing process of the circuit board with a cooling function of  claim 1 , wherein the size of the opening of the main circuit board is equal to or larger than the corresponding electronic component to transmit heat generated by the electronic component through the opening to the thermal plate. 
   
   
       8 . A manufacturing process of a circuit board with a cooling function, comprising:
 forming a thermal interface layer on a thermal plate;   joining a main circuit board comprises at least one opening together with the thermal interface layer; and   combining the thermal plate with the main circuit board.   
   
   
       9 . The manufacturing process of a circuit board with a cooling function of  claim 8 , wherein combining the thermal plate with the main circuit board further comprises using at least one locking element, to fix the thermal plate, the thermal interface layer, and the main circuit board together. 
   
   
       10 . The manufacturing process of a circuit board with a cooling function of  claim 8 , wherein the thermal interface layer is a colloid. 
   
   
       11 . The manufacturing process of a circuit board with a cooling function of  claim 10 , wherein combining the thermal plate with the main circuit board further comprises using the colloid to bind and fix the thermal plate with the main circuit board. 
   
   
       12 . A circuit board with a cooling function, comprising:
 a thermal plate;   a main circuit board, comprises at least one opening disposes on the main circuit board, is capable of disposing at least one electronic component; and   a thermal interface layer, disposed between the thermal plate and the main circuit board, is capable of combining the thermal plate with the main circuit board;   wherein the electronic component is disposed on the opening, and heat generated by the electronic component is transmitted through the opening via the thermal interface layer to the thermal plate.   
   
   
       13 . The circuit board with a cooling function of  claim 12 , wherein the thermal interface layer is a colloid. 
   
   
       14 . The circuit board with a cooling function of  claim 12 , wherein the circuit board with a cooling function further comprises at least one locking element, disposed on the main circuit board, is capable of fixing the thermal plate, the thermal interface layer, and the main circuit board together. 
   
   
       15 . The circuit board with a cooling function of  claim 12 , wherein the thermal interface layer is a solder paste. 
   
   
       16 . The circuit board with a cooling function of  claim 15 , wherein the thermal plate further comprises a first metal thin layer, disposed between the thermal plate and the soldering paste, is capable of combing the thermal plate with the solder paste. 
   
   
       17 . The circuit board with a cooling function of  claim 16 , wherein the material of the first metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead. 
   
   
       18 . The circuit board with a cooling function of  claim 15 , wherein the circuit board with a cooling function further comprises a second metal thin layer, disposed between the main circuit board and the solder paste, is capable of combing the main circuit board with the solder paste. 
   
   
       19 . The circuit board with a cooling function of  claim 18 , wherein the material of the second metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead. 
   
   
       20 . The circuit board with a cooling function of  claim 12 , wherein the size of the opening of the main circuit board is equal to or larger than the corresponding electronic component to transmit heat generated by the electronic component through the opening to the thermal plate.