Light-emitting structures

Abstract

Light-emitting structures of reduced size are realized with combinations of light-emitting diodes, resistive and conductive films, and interconnect members. Other embodiments are provided which simplify fabrication and assembly.

1 . A light-emitting structure, comprising: 
 at least one light-emitting diode having an anode and a cathode and configured to emit a respective color of light;    at least one resistive member positioned on at least one of said anode and cathode; and    at least one conductive contact positioned on said resistive member to facilitate application of a voltage through said resistive member to thereby generate said light.    
   
   
       2 . The structure of  claim 1 , wherein said diode is configured as a die.  
   
   
       3 . The structure of  claim 1 , wherein said diode is a selected one of a semiconductor diode, an organic diode or a polymer diode.  
   
   
       4 . The structure of  claim 1 , wherein said resistive member is configured as a selected one of a resistive film, a thin film resistor or a thick film resistor.  
   
   
       5 . The structure of  claim 1 , wherein said conductive contact is formed from a selected one of a silver ink, a conductive epoxy, a metallic film, or solder.  
   
   
       6 . The structure of  claim 1 , further including an interconnect member coupled to said contact to facilitate said application.  
   
   
       7 . The structure of  claim 6 , wherein said interconnect member is a selected one of a conductive wire, a wire bond or a connective tab.  
   
   
       8 . The structure of  claim 1 , wherein said at least one resistive member comprises a plurality of spaced-apart resistive members having different resistances to facilitate options in said application.  
   
   
       9 . The structure of  claim 8  further including an interconnect member coupled to a contact of a selected one of said reisistive members to facilitate said application.  
   
   
       10 . The structure of  claim 1 , wherein said at least one contact comprises a plurality of contacts spaced over said resistive member to facilitate options in application of said voltage.  
   
   
       11 . The structure of  claim 10 , further including an interconnect member coupled to at least one of said contacts to facilitate said application.  
   
   
       12 . The structure of  claim 10 , further including a plurality of interconnect members each coupled to a respective one of said contacts to facilitate said application.  
   
   
       13 . A light-emitting structure, comprising: 
 a plurality of light-emitting diodes each having an anode and a cathode and configured to emit a respective color of light;    a resistive member positioned on at least one of said anode and cathode of each of said diodes;    a plurality of conductive contacts spaced over said resistive member; and    an interconnect member coupled to at least one of the contacts of each of said diodes to provide an interconnected string of diodes.    
   
   
       14 . The structure of  claim 13 , wherein said resistive member is configured as a selected one of a resistive film, a thin film resistor or a thick film resistor.  
   
   
       15 . The structure of  claim 13 , wherein said conductive contact is formed from a selected one of a silver ink, a conductive epoxy, a metallic film or solder.  
   
   
       16 . The structure of  claim 13 , wherein said interconnect member is a selected one of a conductive wire, a wire bond or a connective tab.  
   
   
       17 . A light-emitting structure, comprising: 
 a plurality of light-emitting diodes each having an anode and a cathode and configured to emit a respective color of light;    a resistive member positioned on at least one of said anode and cathode of each of said diodes;    a plurality of conductive contacts spaced over said resistive member; and    a plurality of interconnect members coupled between selected contacts of said diodes to provide an interconnected string of diodes.    
   
   
       18 . The structure of  claim 17 , wherein said resistive member is configured as a selected one of a resistive film, a thin film resistor or a thick film resistor.  
   
   
       19 . The structure of  claim 17 , wherein said conductive contact is formed from a selected one of a silver ink, a conductive epoxy, a metallic film or solder.  
   
   
       20 . The structure of  claim 17 , wherein each of said interconnect members is a selected one of a conductive wire, a wire bond or a connective tab.