US2008035311A1PendingUtilityA1

Cooler system

Assignee: KWO GER METAL TECHNOLOGY INCPriority: Aug 11, 2006Filed: Aug 11, 2006Published: Feb 14, 2008
Est. expiryAug 11, 2026(~0 yrs left)· nominal 20-yr term from priority
Inventors:Ting-Wei Hsu
H10W 40/237H10W 40/60H10W 40/611H10W 40/73F28D 15/0266F28F 2275/085
37
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Claims

Abstract

A cooler system includes a metal holder base, a mounting structure that secures the metal holder base to a circuit board, a curved heat pipe, which has a mounting portion fastened to one through hole on the metal holder base and a cooling portion extending from the mounting portion to the outside of the metal holder base and the circuit board at an angle, and a heat sink fastened to the cooling portion of the heat pipe outside the metal holder base and the circuit board in a parallel relationship relative to the circuit board for dissipation heat absorbed by the heat pipe from a heat source at the circuit board into the outside open air far from the circuit board efficiently.

Claims

exact text as granted — not AI-modified
1 . A cooler system comprising:
 a metal holder base, said metal holder base having at least one through hole;   a mounting structure fastened to a circuit board to secure said metal holder base to said circuit board; and   a cooler module, said cooler module comprising a heat sink, and at least one heat pipe respectively mounted in said at least one through hole of said metal holder base and adapted to absorb heat from a heat source at said circuit board and to transfer absorbed heat to said heat sink for dissipation;   wherein said at least one heat pipe each has a mounting portion respectively mounted in the at least one through hole of said metal holder base, and a cooling portion extending from said mounting portion at an angle to the outside of said metal holder base and fastened to said heat sink to support said heat sink outside said circuit board in a parallel relationship relative to said circuit board.   
   
   
       2 . The cooler system as claimed in  claim 1 , wherein said mounting structure comprises a metal clamping device and a plurality of fastening members adapted to affix said metal clamping device to said circuit board and said metal holder base. 
   
   
       3 . The cooler system as claimed in  claim 2 , wherein said metal clamping device comprises a metal upper clamping plate and a metal bottom clamping plate respectively clamped on top and bottom sides of said circuit board. 
   
   
       4 . The cooler system as claimed in  claim 1 , wherein said metal holder base has a plurality of radiation fins at a top side thereof. 
   
   
       5 . The cooler system as claimed in  claim 1 , wherein said at least one heat pipe each is a L-shaped pipe having a first end terminating in said mounting portion and a second end terminating in said cooling portion. 
   
   
       6 . The cooler system as claimed in  claim 1 , wherein said at least one heat pipe each is a U-shaped pipe having a first end terminating in said mounting portion and a second end terminating in said cooling portion. 
   
   
       7 . The cooler system as claimed in  claim 1 , wherein said heat sink has at least one mounting through hole respectively coupled to said cooling portion of each of said at least one heat pipe. 
   
   
       8 . The cooler system as claimed in  claim 1 , wherein said heat sink is comprised of a plurality of radiation fins, said radiation fins of said heat sink each having at least one mounting through hole respectively coupled to said cooling portion of each of said at least one heat pipe. 
   
   
       9 . The cooler system as claimed in  claim 8 , further comprising a holding-down device fastened to said metal holder base to hold down said heat sink on said at least one heat pipe.

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