Light emitting device package and method for manufacturing the same

Abstract

A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.

1 . A light emitting device package comprising: 
 a package body;    an electrode formed over at least one surface of the package body;    a light emitting device mounted over the package body; and    a phosphor layer formed over the light emitting device while having a uniform thickness around the light emitting device.    
   
   
       2 . The light emitting device package according to  claim 1 , wherein the thickness of the phosphor layer arranged over an upper surface of the light emitting device is equal to the thickness of the phosphor layer arranged on each side surface of the light emitting device.  
   
   
       3 . The light emitting device package according to  claim 1 , wherein the phosphor layer has a horizontal width equal to a horizontal width of the package body.  
   
   
       4 . The light emitting device package according to  claim 1 , wherein the electrode comprises: 
 an upper electrode formed over an upper surface of the package body; and    a lower electrode formed over a lower surface of the package body, and connected to the upper electrode.    
   
   
       5 . The light emitting device package according to  claim 4 , wherein the upper and lower electrodes are connected via a through hole formed through the package body.  
   
   
       6 . The light emitting device package according to  claim 1 , wherein the phosphor layer is arranged inside a transparent barrier rib arranged around the light emitting device while being uniformly spaced apart from the light emitting device.  
   
   
       7 . The light emitting device package according to  claim 6 , wherein the barrier rib is made of one of a transparent photoresist, a photosensitive polymer, and glass.  
   
   
       8 . The light emitting device package according to  claim 6 , wherein the barrier rib has a height difference from an upper surface of the light emitting device, the height difference being equal to a distance between each side surface of the light emitting device and the barrier rib.  
   
   
       9 . The light emitting device package according to  claim 1 , wherein the phosphor layer is made of a filler containing phosphors.  
   
   
       10 . The light emitting device package according to  claim 1 , wherein the light emitting device is mounted to a recess-shaped mount formed at the package body.  
   
   
       11 . The light emitting device package according to  claim 10 , wherein the mount has a height from an upper surface of the light emitting device, the height being equal to a horizontal distance of the mount from each side surface of the light emitting device.  
   
   
       12 . The light emitting device package according to  claim 10 , wherein the mount has a depth equal to 2 to 6 times a height of the light emitting device.  
   
   
       13 . The light emitting device package according to  claim 10 , wherein the mount has a horizontal or vertical length equal to 1.2 to 2 times a horizontal or vertical width of the light emitting device.  
   
   
       14 . A method for manufacturing a light emitting device package, comprising: 
 forming a plurality of electrodes over a substrate;    bonding light emitting devices to the substrate such that the light emitting devices are connected to the electrodes;    forming a phosphor layer over the substrate bonded with the light emitting devices; and    dicing the substrate and the phosphor layer into unit packages such that the phosphor layer over an upper surface of the light emitting device in each unit package has a thickness equal to a thickness of the phosphor layer over each side surface of the light emitting device in the unit package.    
   
   
       15 . The method according to  claim 14 , wherein a spacing between adjacent ones of the light emitting devices is equal to two times the thickness of the phosphor layer present over the upper surface of each light emitting device or is equal to a length obtained by adding a width removed at the dicing step to two times the thickness of the phosphor layer present over the upper surface of each light emitting device.  
   
   
       16 . The method according to  claim 14 , wherein each unit package includes a plurality of light emitting devices.  
   
   
       17 . A method for manufacturing a light emitting device package, comprising: 
 forming a barrier rib defining a region surrounding a light emitting device over a mount of a substrate for mounting the light emitting device;    mounting the light emitting device over the mount; and    filling phosphors inside the barrier rib.    
   
   
       18 . The method according to  claim 17 , further comprising: 
 forming electrodes on the substrate before the formation of the barrier rib.    
   
   
       19 . The method according to  claim 17 , wherein the formation of the barrier rib is carried out by coating a photosensitive polymer over the substrate, and etching the coated photosensitive polymer in accordance with a photolithography process.  
   
   
       20 . The method according to  claim 17 , wherein the formation of the barrier rib is carried out by preparing a barrier rib made of a transparent material, and attaching the prepared barrier rib to the substrate.