IC Package, IC Socket, and IC Socket Assembly

Abstract

An IC socket assembly includes an IC socket, constituted by: a plurality of electrical contacts; an IC package mounting surface; an insulative socket housing for holding the plurality of electrical contacts at the IC package mounting surface; and an urging member for urging an IC package, which is mounted on the IC package mounting surface, toward the plurality of electrical contacts so as to establish electrical connections therewith; and the IC package. The IC package has a frame member provided about the periphery of a main body thereof.

1 . An IC package to be mounted onto an IC socket, comprising: 
 an IC package main body; and    a frame member provided about the periphery of the IC package main body.    
   
   
       2 . The IC package of  claim 1  wherein the frame member comprises substantially square peripheral walls that cover the periphery of the IC package main body.  
   
   
       3 . The IC package of  claim 2  wherein two opposing ones of the peripheral walls are formed as relatively short height walls.  
   
   
       4 . The IC package of  claim 3  wherein the other two peripheral walls are formed as relatively tall height walls having greater heights than the relatively short height walls.  
   
   
       5 . The IC package of  claim 2  further comprising protrusions on the peripheral walls for preventing erroneous insertion of the IC package.  
   
   
       6 . The IC package of  claim 2  further comprising receiving protrusions formed on inner sides of the peripheral walls.  
   
   
       7 . The IC package of  claim 6  wherein each receiving protrusion comprises a receiving base for receiving the IC package.  
   
   
       8 . The IC package of  claim 7  wherein each receiving protrusion comprises a taper for facilitating insertion of the IC package.  
   
   
       9 . The IC package of  claim 8  further comprising an extraction preventing protrusion formed between two of the receiving protrusions on the peripheral walls.  
   
   
       10 . The IC package of  claim 9  wherein the extraction preventing protrusion extends from an upper edge of the frame member to a lower edge thereof.  
   
   
       11 . The IC package of  claim 10  further comprising a taper formed on the extraction preventing protrusion near the upper edge to facilitate insertion of the IC package main body.  
   
   
       12 . The IC package of  claim 11  further comprising a stop surface formed on the extracting preventing protrusion near the lower edge.  
   
   
       13 . The IC package of  claim 12  wherein the frame member is configured to hold the inserted IC package main body between the receiving bases and the stop surface.  
   
   
       14 . The IC package of  claim 13  further comprising ribs firmed in the peripheral walls and located to correspond with keying grooves of a cover housing in which IC package is to be mounted.  
   
   
       15 . The IC package of  claim 6  wherein the receiving protrusions are formed in the vicinities of corners of the frame member.  
   
   
       16 - 39 . (canceled)