Air cooling/heating device

Abstract

An air cooling/heating device includes: a housing unit having first and second compartments, formed with a first opening and a first mounting hole in spatial communication with the first compartment, and further formed with a second opening unit and a second mounting hole in spatial communication with the second compartment; a thermal energy storing unit and a pipe disposed in the first compartment, and adapted to contain antifreeze liquid; a pump connected in series to the pipe, and operable to deliver the antifreeze liquid between the thermal energy storing unit and the pipe; a thermoelectric semiconductor device disposed in the second compartment, and in thermal contact with the thermal energy storing unit; and a turbulence unit including first and second fans that are mounted in the first and second mounting holes in the housing body, respectively.

1 . An air cooling/heating device comprising:
 a housing unit including a housing body, and a partition plate disposed in and connected to said housing body such that said partition plate divides an interior of said housing body into first and second compartments, said housing body being formed with a first opening and a first mounting hole in spatial communication with said first compartment, said housing body being further formed with a second opening unit and a second mounting hole in spatial communication with said second compartment;   a thermal energy storing unit mounted to said partition plate of said housing unit, disposed in said first compartment, and adapted to contain antifreeze liquid;   an energy exchange unit disposed in said first compartment, and including a pipe that is connected to said thermal energy storing unit to form a closed loop therewith;   a pump connected in series to said pipe of said energy exchange unit, and operable to deliver the antifreeze liquid contained in said thermal energy storing unit to said energy exchange unit and to return the antifreeze liquid in said energy exchange unit back to said thermal energy storing unit;   a thermoelectric semiconductor device disposed in said second compartment, and having a first side in thermal contact with said thermal energy storing unit; and   a turbulence unit including first and second fans mounted in said first and second mounting holes in said housing body, respectively.   
   
   
       2 . The air cooling/heating device as claimed in  claim 1 , further comprising a power supply unit mounted in said housing unit and connected electrically to said pump. 
   
   
       3 . The air cooling/heating device as claimed in  claim 1 , further comprising a heat guide disposed in said second compartment, and fixed to a second side of said thermoelectric semiconductor device. 
   
   
       4 . The air cooling/heating device as claimed in  claim 3 , wherein said heat guide is a comb-shaped heat sink. 
   
   
       5 . The air cooling/heating device as claimed in  claim 1 , wherein said second mounting hole is registered with said thermoelectric semiconductor device. 
   
   
       6 . The air cooling/heating device as claimed in  claim 5 , wherein said second opening unit includes second and third openings, and said second mounting hole is disposed between said second and third openings. 
   
   
       7 . The air cooling/heating device as claimed in  claim 1 , wherein said first fan is operable to draw air out of said first compartment, and said second fan is operable to draw air into said second compartment. 
   
   
       8 . The air cooling/heating device as claimed in  claim 3 , wherein said thermoelectric semiconductor device is operable to absorb heat at one of said first and second sides, and to dissipate heat at the other one of said first and second sides. 
   
   
       9 . The air cooling/heating device as claimed in  claim 1 , wherein said thermal energy storing unit is embedded in said partition plate of said housing unit.