Cleaning solution spraying unit and wafer cleaning apparatus with the same

Abstract

There is provided a cleaning solution spraying unit. The cleaning solution spraying unit comprises a number of nozzles installed in a nozzle base, along a top surface of a wafer, and radially spraying a cleaning solution on the wafer, wherein the nozzle base is positioned above the wafer; and a power unit rotating the nozzles at a predetermined angle relative to a line extending perpendicularly from the top surface of the wafer. In addition, provided is a wafer cleaning apparatus including the cleaning solution spraying unit with the above-described constitution.

1 . A cleaning solution spraying unit comprising:
 a set of nozzles installed in a nozzle base supported above a top surface of a wafer, the set of nozzles configured to radially spray a cleaning solution on the wafer; and   a power unit configured to rotate the nozzles at a predetermined angle relative to a line extending perpendicularly from the top surface of the wafer.   
     
     
         2 . The cleaning solution spraying unit according to  claim 1 , wherein the angle at which the cleaning solution is sprayed from the nozzles becomes progressively larger as the nozzles are positioned away from a center nozzle, with the largest angle being in the outermost nozzles. 
     
     
         3 . The cleaning solution spraying unit according to  claim 1 , wherein the power unit comprises:
 a first motor installed at an end of a first rotation shaft extended from the nozzle base, along a direction in which the nozzles are arranged; and   a first controller configured to transmit an electrical signal to the first motor, to rotate the nozzle base at a predetermined rotation angle.   
     
     
         4 . The cleaning solution spraying unit according to  claim 3 , wherein the first controller is configured to swing the nozzle base within a range of the predetermined angle using the first motor. 
     
     
         5 . The cleaning solution spraying unit according to  claim 1 , wherein the power unit comprises:
 a set of third motors installed at a support shaft axially connected to the set of nozzles, so that each third motor is connected to a corresponding nozzle from the set of nozzles; and   a third controller configured to transmit an electrical signal to each third motor, to rotate one or more nozzle in the set of nozzles at a predetermined rotation angle.   
     
     
         6 . The cleaning solution spraying unit according to  claim 5 , wherein the third controller is configured to swing the one or more nozzle in the set of nozzles within a range of the predetermined angle using the third motors such that the cleaning solution is sprayed from the nozzles in a same direction. 
     
     
         7 . The cleaning solution spraying unit according to  claim 5 , wherein the third controller is configured to swing the one or more nozzle in the set of nozzles within a range of the predetermined angle using the third motors such that the cleaning solution is sprayed from the nozzles in cross directions. 
     
     
         8 . The cleaning solution spraying unit according to  claim 1 , further comprising:
 a second motor connected to a second rotation shaft positioned on a middle upper portion of the nozzle base; and   a second controller electrically connected to the second motor and configured to rotate the nozzle base at a predetermined rotation speed.   
     
     
         9 . A wafer cleaning apparatus comprising:
 a spin chuck, on which a wafer is held, configured to be rotated at a first predetermined speed;   a nozzle base positioned above the spin chuck and configured to be rotated at second a predetermined speed;   a set of nozzles installed in the nozzle base, including nozzle tips configured to radially spray a cleaning solution on a top surface of the wafer;   a power unit configured to position the set of nozzles at a predetermined angle relative to a line extending perpendicularly from the top surface of the wafer; and   a rotator configured to selectively rotate at least one of the spin chuck and the nozzle base.   
     
     
         10 . The wafer cleaning apparatus according to  claim 9 , wherein the angle at which the cleaning solution is sprayed from the nozzles becomes progressively larger as the nozzles are positioned away from a center nozzle, with the largest angle being in the outermost nozzles. 
     
     
         11 . The wafer cleaning apparatus according to  claim 9 , wherein the power unit comprises:
 a first motor installed at an end of a first rotation shaft extended from the nozzle base, along a direction in which the nozzles are arranged; and   a first controller configured to transmit an electrical signal to the first motor, to rotate the nozzle base at a predetermined rotation angle.   
     
     
         12 . The wafer cleaning apparatus according to  claim 11 , wherein the first controller is configured to swing the nozzle base within a range of the predetermined angle using the first motor. 
     
     
         13 . The wafer cleaning apparatus according to  claim 9 , wherein the power unit comprises:
 a set of third motors installed at a third shaft axially connected to the set of nozzles, so that each third motor is connected to a corresponding nozzle from the set of nozzles; and   a third controller configured to transmit an electrical signal to each third motor, to rotate one or more nozzle in the set of nozzles at a predetermined rotation angle.   
     
     
         14 . The wafer cleaning apparatus according to  claim 13 , wherein the third controller is configured to swing the at least one nozzle in the set of nozzles within a range of the predetermined angle using the third motors such that the cleaning solution is sprayed from the nozzles in a same direction. 
     
     
         15 . The wafer cleaning apparatus according to  claim 13 , wherein the third controller configured to swing the at least one nozzle in the set of nozzles within a range of the predetermined angle using the third motors such that the cleaning solution is sprayed from the nozzles in cross directions. 
     
     
         16 . The wafer cleaning apparatus according to  claim 9 , wherein the rotator comprises:
 a second motor connected to a second rotation shaft positioned on a middle upper portion of the nozzle base; and   a second controller electrically connected to the second motor and configured to rotate the nozzle base at a predetermined rotation speed.