US2008041443A1PendingUtilityA1
Thinned solar cell
Est. expiryAug 16, 2026(~0.1 yrs left)· nominal 20-yr term from priority
H10F 77/1465H10F 77/147H10F 77/63H10F 71/121H10F 77/315Y02E10/547Y02P70/50B82Y 20/00
42
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Claims
Abstract
The present invention relates to a solar or photovoltaic cell wherein the thickness of the photovoltaic substrate is reduced such that the efficiency of the photovoltaic cell is about 100% greater than a typical photovoltaic cell. The solar cell can also include a cold plate located adjacent to the solar cell to remove heat from the solar cell.
Claims
exact text as granted — not AI-modified1 . A photovoltaic cell comprising a substrate, wherein the thickness of the outer layer of the substrate is reduced such that the efficiency of the photovoltaic cell is about 100% greater than that of a photovoltaic cell in which the outer layer of the photovoltaic cell is not reduced.
2 . The photovoltaic cell of claim 1 , wherein substrate comprises silicon and doped silicon layers.
3 . The photovoltaic cell of claim 1 , further comprising a temperature controlled cold plate adjacent to the photovoltaic cell to remove heat therefrom.
4 . The photovoltaic cell of claim 3 , wherein the cold plate comprises a semi-conductor Thermal Electric cooling device of the Peltier type.
5 . The photovoltaic device of claim 1 , further comprising an anti-reflective coating.
6 . The photovoltaic device of claim 5 , wherein the anti-reflective coating comprises hafnium dioxide, titanium dioxide, silicon dioxide, or mixtures thereof.
7 . The photovoltaic device of claim 5 , wherein the anti-reflective coating has a refractive index of about n=1.9.
8 . The photovoltaic device of claim 1 , wherein the thickness of the outer layer of photovoltaic substrate is reduced by grinding.
9 . The photovoltaic device of claim 1 , wherein the thickness of the outer layer is reduced by chemical etching.
10 . The photovoltaic device of claim 1 , wherein the thickness of the outer layer is reduced by ion bombardment.
11 . A method of increasing the efficiency of a photovoltaic cell comprising a substrate by at least 100%, the method comprising reducing the thickness of the outer layer of the substrate.
12 . The method of claim 11 , wherein the thickness of the outer layer of the substrate is reduced by etching the substrate.
13 . The method of claim 11 , wherein the thickness of the outer layer of the substrate is reduced by grinding the substrate.
14 . The method of claim 11 , wherein the thickness of the outer layer of the substrate is reduced by ion bombardment of the substrate.
15 . The method of claim 11 , further comprising adding a cooling device adjacent to the photovoltaic cell to cool the cell during use.
16 . The method of claim 15 , wherein the cooling device is a Peltier cooler.
17 . The method of claim 11 , further comprising adding a reflective coating to the photovoltaic cell after the thickness of the outer layer of substrate is reduced.Join the waitlist — get patent alerts
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