Copper alloy

Abstract

A copper alloy, containing: Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, with a balance being Cu and inevitable impurities; the copper alloy having a precipitate X composed of Ni and Si; and a precipitate Y composed of Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, in which a grain diameter of the precipitate Y is 0.01 to 2 μm.

1 . A copper alloy, having: a precipitate Y composed of Ni and/or Si, and at least one or more selected from the group consisting of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be; and a precipitate X composed of Ni and Si, wherein a grain diameter of the precipitate Y is 0.01 to 2 μm.  
   
   
       2 . The copper alloy according to  claim 1 , wherein the grain diameter of the precipitate Y is 0.02 to 0.9 μm.  
   
   
       3 . The copper alloy according to  claim 1 , wherein the melting point of the precipitate Y is higher than a solid solution treatment temperature.  
   
   
       4 . The copper alloy according to  claim 1 , wherein the number of precipitates X per mm 2  is 20 to 2,000 times the number of precipitates Y per mm 2 .  
   
   
       5 . The copper alloy according to claims  1 , wherein the number of precipitates X is 10 8  to 10 12  per mm 2 , and the number of precipitates Y is 10 4  to 10 8  per mm 2 .  
   
   
       6 . The copper alloy according to  claim 1 , wherein a composition of the copper alloy further comprises at least one or more selected from Sn 0.1 to 1.0 mass %, Zn 0.1 to 1.0 mass %, and Mg 0.05 to 0.5 mass %.  
   
   
       7 . The copper alloy according to  claim 1 , which has a stress relaxation ratio of less than 20%.  
   
   
       8 . The copper alloy according to  claim 1 , which is for use as a material of an electric or electronic instrument.  
   
   
       9 . A copper alloy, having: a precipitate X composed of Ni and Si; and at least one precipitate selected from the group consisting of a precipitate Y1 composed of Ni, Si, and Cr, a precipitate Y2 composed of Ni, Si, and Co, a precipitate Y3 composed of Ni, Si, and Zr, and a precipitate Z composed of Ni, Si, and B, wherein a grain diameter of the at least one precipitate selected from the group consisting of the precipitates Y1, Y2, Y3, and Z is 0.1 to 2 μm.  
   
   
       10 . The copper alloy according to  claim 9 , wherein the melting point of the precipitate Y is higher than a solid solution treatment temperature.  
   
   
       11 . The copper alloy according to  claim 9 , wherein the number of precipitates X per mm 2  is 20 to 2,000 times the number of precipitates Y per mm 2 .  
   
   
       12 . The copper alloy according to  claim 9 , wherein the number of precipitates X is 10 8  to 10 12  per mm 2 , and the number of precipitates Y is 10 4  to 10 8 , per mm 2 .  
   
   
       13 . The copper alloy according to  claim 9 , wherein a composition of the copper alloy further comprises at least one or more selected from Sn 0.1 to 1.0 mass %, Zn 0.1 to 1.0 mass %, and Mg 0.05 to 0.5 mass %.  
   
   
       14 . The copper alloy according to  claim 9 , which has a stress relaxation ratio of less than 20%.  
   
   
       15 . The copper alloy according to  claim 9 , which is for use as a material of an electric or electronic instrument.  
   
   
       16 . A copper alloy, comprising: Ni 2.0 to 5.0 mass %, Si 0.3 to 1.5 mass %, at least one or more selected from the group consisting of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be each in an amount of 0.005 to 1.0 mass %, with a balance being Cu and inevitable impurities; 
 said copper alloy having a precipitate X composed of Ni and Si; and a precipitate Y composed of Ni, Si, and at least one or more selected from the group consisting of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, wherein a grain diameter of the precipitate Y is 0.01 to 2 μm.    
   
   
       17 . The copper alloy according to  claim 16 , wherein the melting point of the precipitate Y is higher than a solid solution treatment temperature.  
   
   
       18 . The copper alloy according to  claim 16 , wherein the number of precipitates X per mm 2  is 20 to 2,000 times the number of precipitates Y per mm 2 .  
   
   
       19 . The copper alloy according to  claim 16 , wherein the number of precipitates X is 10 8  to 10 12  per mm 2 , and the number of precipitates Y is 10 4  to 10 8  per mm 2 .  
   
   
       20 . The copper alloy according to  claim 16 , wherein a composition of the copper alloy further comprises at least one or more selected from Sn 0.1 to 1.0 mass %, Zn 0.1 to 1.0 mass %, and Mg 0.05 to 0.5 mass %.  
   
   
       21 . The copper alloy according to  claim 16 , which has a stress relaxation ratio of less than 20%.  
   
   
       22 . The copper alloy according to  claim 16 , which is for use as a material of an electric or electronic instrument.  
   
   
       23 . A copper alloy, comprising: Ni 2.0 to 5.0 mass %, Si 0.3 to 1.5 mass %, at least one or more selected from the group consisting of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be each in an amount of 0.005 to 1.0 mass %, with a balance being Cu and inevitable impurities; 
 said copper alloy having a precipitate X composed of Ni and Si; and a precipitate Y composed of Ni, and at least two or more selected from the group consisting of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, wherein a grain diameter of the precipitate Y is 0.01 to 2 μm.    
   
   
       24 . The copper alloy according to  claim 23 , wherein the melting point of the precipitate Y is higher than a solid solution treatment temperature.  
   
   
       25 . The copper alloy according to  claim 23 , wherein the number of precipitates X per mm 2  is 20 to 2,000 times the number of precipitates Y per mm 2 .  
   
   
       26 . The copper alloy according to  claim 23 , wherein the number of precipitates X is 10 8  to 10 12  per mm 2 , and the number of precipitates Y is 10 4  to 10 8  per mm 2 .  
   
   
       27 . The copper alloy according to  claim 23 , wherein a composition of the copper alloy further comprises at least one or more selected from Sn 0.1 to 1.0 mass %, Zn 0.1 to 1.0 mass %, and Mg 0.05 to 0.5 mass %.  
   
   
       28 . The copper alloy according to  claim 23 , which has a stress relaxation ratio of less than 20%.  
   
   
       29 . The copper alloy according to  claim 23 , which is for use as a material of an electric or electronic instrument.  
   
   
       30 . A copper alloy, comprising: Ni 2.0 to 5.0 mass %, Si 0.3 to 1.5 mass %, at least one or more selected from the group consisting of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be each in an amount of 0.005 to 1.0 mass %, with a balance being Cu and inevitable impurities; 
 said copper alloy having a precipitate X composed of Ni and Si; and a precipitate Y composed of Si, and at least two or more selected from the group consisting of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, wherein a grain diameter of the precipitate Y is 0.01 to 2 μm.    
   
   
       31 . The copper alloy according to  claim 30 , wherein the melting point of the precipitate Y is higher than a solid solution treatment temperature.  
   
   
       32 . The copper alloy according to  claim 30 , wherein the number of precipitates X per mm 2  is 20 to 2,000 times the number of precipitates Y per mm 2 .  
   
   
       33 . The copper alloy according to  claim 30 , wherein the number of precipitates X is 10 8  to 10 12  per mm 2 , and the number of precipitates Y is 10 4  to 10 8  per mm 2 .  
   
   
       34 . The copper alloy according to  claim 30 , wherein a composition of the copper alloy further comprises at least one or more selected from Sn 0.1 to 1.0 mass %, Zn 0.1 to 1.0 mass %, and Mg 0.05 to 0.5 mass %.  
   
   
       35 . The copper alloy according to  claim 30 , which has a stress relaxation ratio of less than 20%.  
   
   
       36 . The copper alloy according to  claim 30 , which is for use as a material of an electric or electronic instrument.  
   
   
       37 . A copper alloy, comprising: Ni 2.0 to 5.0 mass %, Si 0.3 to 1.5 mass %, at least one or more selected from the group consisting of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be each in an amount of 0.005 to 1.0 mass %, with a balance being Cu and inevitable impurities; said copper alloy having a precipitate X composed of Ni and Si; and a precipitate Y composed of at least three or more selected from the group consisting of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, wherein a grain diameter of the precipitate Y is 0.01 to 2 μm.  
   
   
       38 . The copper alloy according to  claim 37 , wherein the melting point of the precipitate Y is higher than a solid solution treatment temperature.  
   
   
       39 . The copper alloy according to  claim 37 , wherein the number of precipitates X per mm 2  is 20 to 2,000 times the number of precipitates Y per mm 2 .  
   
   
       40 . The copper alloy according to  claim 37 , wherein the number of precipitates X is 10 8  to 10 12  per mm 2 , and the number of precipitates Y is 10 4  to 10 8  per mm 2 .  
   
   
       41 . The copper alloy according to  claim 37 , wherein a composition of the copper alloy further comprises at least one or more selected from Sn 0.1 to 1.0 mass %, Zn 0.1 to 1.0 mass %, and Mg 0.05 to 0.5 mass %.  
   
   
       42 . The copper alloy according to  claim 37 , which has a stress relaxation ratio of less than 20%.  
   
   
       43 . The copper alloy according to  claim 37 , which is for use as a material of an electric or electronic instrument.