Multilayered printed wiring board and method for manufacturing the same

Abstract

A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.

1 . A multilayered printed wiring board, comprising:
 a flexible wiring board with wiring layers on both main surfaces thereof;   a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to said flexible wiring board under the condition that an area of said main surface of said rigid wiring board is smaller than an area of said main surface of said flexible wiring board; and   an electric/electronic component embedded in said rigid wiring board.   
   
   
       2 . The multilayered printed wiring board as set forth in  claim 1 , further comprising:
 an insulating layer disposed between said flexible wiring board and said rigid wiring board; and   an interlayer connection conductor formed along an axial direction thereof and disposed between said flexible wiring board and said rigid wiring board through said insulating layer so as to electrically connect said flexible wiring board and said rigid wiring board via said wiring layers formed on said main surfaces of said flexible wiring board and said rigid wiring board,   wherein a diameter of said interlayer connection conductor in the side of said rigid wiring board is set smaller than a diameter of said interlayer connection conductor in the side of said flexible wiring board.   
   
   
       3 . The multilayered printed wiring board as set forth in  claim 1 ,
 wherein said electric/electronic component is disposed on a first wiring layer contained in said rigid wiring board so that said electric/electronic component can be electrically connected with said wiring layer via an connection.   
   
   
       4 . The multilayered printed wiring board as set forth in  claim 3 ,
 wherein said rigid wiring board includes a second wiring layer in the side of said flexible wiring board with respect to said first wiring layer; and   wherein another interlayer connection conductor is disposed between said first wiring layer and said second wiring layer so as to electrically connect said first wiring layer and said second wiring layer.   
   
   
       5 . A multilayered printed wiring board, comprising:
 a flexible wiring board with wiring layers on both main surfaces thereof;   a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to said flexible wiring board via an insulating layer;   an interlayer connection conductor disposed through said insulating layer so as to electrically connect said flexible wiring board and said rigid wiring board under the condition that a forefront of said interlayer connection conductor is plastically deformed through the connection for said rigid wiring board and a bottom of said interlayer connection conductor is connected with a connection land of said wiring layer of said flexible wiring board; and   an electric/electronic component embedded in said rigid wiring board.   
   
   
       6 . The multilayered printed wiring board as set forth in  claim 5 ,
 wherein said rigid wiring board comprises:
 a first rigid board to mount said electric/electronic component on a main surface thereof; 
 a second rigid board disposed opposite to said main surface of said first rigid board on which said electric/electronic component is mounted under the condition that a roll off to house said electric/electronic component is formed as a through-hole at said second rigid board; 
 an insulating layer disposed between said first rigid board and said second rigid board and surrounding said electric/electronic component so as to embed said roll off; and 
 an interlayer connection conductor disposed through said insulating layer under the condition that a diameter of said interlayer connection conductor in the side of said first rigid board is set smaller than a diameter of said interlayer connection conductor in the side of said second rigid board, 
   wherein said second rigid board of said rigid wiring board is connected with said flexible wiring board.   
   
   
       7 . The multilayered printed wiring board as set forth in  claim 5 ,
 wherein said flexible wiring board is exposed on a main surface of said multilayered printed wiring board so that said main surface of said multilayered printed wiring board can be flattened and said flexible wiring board and said rigid wiring board are exposed on the other main surface of said multilayered printed wiring board.   
   
   
       8 . The multilayered printed wiring board as set forth in  claim 6 ,
 wherein said electric/electronic component is embedded in a resin of a prepreg to be converted into said insulating layer.   
   
   
       9 . A method for manufacturing a multilayered printed wiring board, comprising the steps of:
 preparing a first rigid board and a second rigid board; mounting an electric/electronic component on a main surface of said first rigid board;   forming a roll off to house said electric/electronic component at said second rigid board;   laminating said first rigid board and said second rigid board so that said electric/electronic component can be inserted in said roll off, thereby forming a rigid wiring board; and   laminating said rigid wiring board and a flexible wiring board via a prepreg to be converted into an insulating layer so that said rigid wiring board can be electrically connected with said flexible wiring board via an interlayer connection conductor.   
   
   
       10 . The manufacturing method as set forth in  claim 9 ,
 wherein said interlayer connection conductor is made of a conductive bump by means of screen printing.