Ethylene terephthalate polymer retaining ring for a chemical mechanical polishing head

Abstract

Embodiments of a retaining ring for use with a chemical mechanical polishing process with a body including a polyethylene terephthalate polymer or polymer including ethylene terephthalate monomers are disclosed.

1 . A retaining ring for use in a chemical mechanical polishing process, a body of the retaining ring comprises a PET polymer, wherein the PET polymer is free or substantially free of inorganic particles. 
     
     
         2 . The retaining ring of  claim 1 , wherein the inorganic particles comprise filler particles, nucleating agents, or both. 
     
     
         3 . The retaining ring of  claim 1 , wherein a portion of the body of the retaining ring comprises the PET polymer. 
     
     
         4 . The retaining ring of  claim 1 , wherein all or a majority of the body of the retaining ring comprises the PET polymer. 
     
     
         5 . The retaining ring of  claim 1 , wherein the body of the retaining ring comprises at least one additional polymer blended with the PET polymer. 
     
     
         6 . The retaining ring of  claim 1 , wherein the body of the retaining ring further comprises organic filler particles dispersed within the PET polymer in an amount less than or equal to 2% by weight. 
     
     
         7 . The retaining ring of  claim 6 , wherein the organic particles comprise TEFLON particles. 
     
     
         8 . A retaining ring for use in a chemical mechanical polishing process, a body of the retaining ring comprises a polymer, the polymer comprising ethylene terephthalate monomers, wherein the polymer is free or substantially free of inorganic particles. 
     
     
         9 . The retaining ring of  claim 8 , wherein the inorganic particles comprise filler particles, nucleating agents, or both. 
     
     
         10 . The retaining ring of  claim 8 , wherein all or a majority of the body of the retaining ring comprises the polymer including the ethylene terephthalate monomer. 
     
     
         11 . The retaining ring of  claim 8 , wherein a portion of the body of the retaining ring comprises the polymer including the ethylene terephthalate monomers. 
     
     
         12 . The retaining ring of  claim 8 , wherein the polymer is a copolymer, the copolymer comprising one or more additional monomers. 
     
     
         13 . The retaining ring of  claim 12 , wherein the additional monomers are selected from the group consisting of phenylene sulfide and etherketone. 
     
     
         14 . The retaining ring of  claim 8 , wherein a majority of the polymer comprises ethylene terephthalate monomers. 
     
     
         15 . The retaining ring of  claim 8 , wherein the body of the retaining ring comprises at least one additional polymer blended with the polymer. 
     
     
         16 . The retaining ring of  claim 8 , wherein the body of the retaining ring further comprises organic filler particles dispersed within the polymer in an amount less than or equal to 2.0 % by weight. 
     
     
         17 . The retaining ring of  claim 16 , wherein the organic particles comprise TEFLON particles. 
     
     
         18 . A method of polishing a substrate comprising:
 providing a chemical mechanical polishing apparatus comprising a retaining ring having a body, the body including a polymer including a PET polymer, wherein the polymer is free or substantially free of inorganic particles;   retaining the substrate using the retaining ring; and   polishing the substrate including the step of placing the body in contact with a polishing pad surface.   
     
     
         19 . The method of  claim 18 , wherein the body of the retaining ring is free of organic particles. 
     
     
         20 . The method of  claim 18 , wherein all or a majority of the body of the retaining ring comprises the PET polymer. 
     
     
         21 . The method of  claim 18 , wherein the body of the retaining ring further comprises organic filler particles dispersed within the PET polymer. 
     
     
         22 . A method of polishing a substrate comprising the step of:
 providing a chemical mechanical polishing apparatus, the apparatus comprising a retaining ring having a body, the body comprising ethylene terephthalate monomer, wherein the polymer is free or substantially free of inorganic particles;   retaining the substrate using the retaining ring; and   polishing the substrate including the step of placing the body in contact with a polishing pad surface.   
     
     
         23 . The method of  claim 22 , wherein the body of the retaining ring is free of organic particles. 
     
     
         24 . The method of  claim 22 , wherein a majority of the polymer comprises ethylene terephthalate monomers. 
     
     
         25 . The method of  claim 22 , wherein the polymer is a copolymer, the copolymer comprising one or more additional monomers. 
     
     
         26 . The method of  claim 22 , wherein the body of the retaining ring further comprises organic filler particles dispersed within the polymer. 
     
     
         27 . A retaining ring for use in a chemical mechanical polishing process, a body of the retaining ring comprises a PET polymer, wherein the PET polymer has organic filler particles dispersed therein and the PET polymer is free or substantially free of inorganic particles. 
     
     
         28 . The retainer ring of  claim 27 , wherein the PET polymer has less than 0.1% organic particles dispersed therein. 
     
     
         29 . A retaining ring for use in a chemical mechanical polishing process, a body of the retaining ring comprises a polymer, the polymer comprising ethylene terephthalate monomers, wherein the polymer has organic filler particles dispersed therein and the polymer is free or substantially free of inorganic particles. 
     
     
         30 . The retainer ring of  claim 29 , wherein the polymer has less than 0.1% organic particles dispersed therein.