US2008053488A1PendingUtilityA1

Substrate treatment apparatus and substrate treatment method

Assignee: UCHIDA HIROAKIPriority: Aug 31, 2006Filed: Aug 31, 2007Published: Mar 6, 2008
Est. expiryAug 31, 2026(~0.1 yrs left)· nominal 20-yr term from priority
Inventors:Hiroaki Uchida
H10P 72/0414H10P 72/70H10P 52/00
38
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A substrate treatment apparatus according to the present invention includes: a substrate holding unit which holds a substrate; a push-pull plate to be positioned in spaced opposed relation to one surface of the substrate held by the substrate holding unit, the push-pull plate having a plurality of outlet ports which discharge a treatment liquid and a plurality of suction ports which suck the treatment liquid discharged from the outlet ports, the outlet ports and the suction ports being provided in a surface of the push-pull plate to be opposed to the one surface of the substrate; and a relative rotation unit which rotates the substrate held by the substrate holding unit and the push-pull plate relative to each other.

Claims

exact text as granted — not AI-modified
1 . A substrate treatment apparatus comprising:
 a substrate holding unit which holds a substrate;   a push-pull plate to be positioned in spaced opposed relation to one surface of the substrate held by the substrate holding unit, the push-pull plate having a plurality of outlet ports which discharge a treatment liquid and a plurality of suction ports which suck the treatment liquid discharged from the outlet ports, the outlet ports and the suction ports being provided in a surface of the push-pull plate to be opposed to the one surface of the substrate; and   a relative rotation unit which rotates the substrate held by the substrate holding unit and the push-pull plate relative to each other.   
   
   
       2 . A substrate treatment apparatus as set forth in  claim 1 , wherein the relative rotation unit rotates the substrate held by the substrate holding unit about an axis extending through a center of the substrate. 
   
   
       3 . A substrate treatment method comprising the steps of:
 holding a substrate by a substrate holding unit;   positioning a push-pull plate in spaced opposed relation to one surface of the substrate held by the substrate holding unit, the push-pull plate having a plurality of outlet ports which discharge a treatment liquid and a plurality of suction ports which suck the treatment liquid discharged from the outlet ports, and bringing the treatment liquid discharged from the outlet ports into contact with the one surface of the substrate; and   rotating the substrate and the push-pull plate relative to each other in the liquid contacting step.

Join the waitlist — get patent alerts

Track US2008053488A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.