Microelectronic device having a plurality of stacked microelectronic dies and methods for manufacturing such microelectronic assemblies

Abstract

Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die is subsequently stacked on the base die. The first stacked die is stacked on the base die in a single pass through a die attach machine without first storing or otherwise processing the base die/substrate assembly in a separate machine. The stacked die, moreover, can be stacked onto the base die before heating the base die to reflow a solder or otherwise attach the base die to the substrate. After stacking the first stacked die on the base die, the complete die assembly can be heated to (a) secure the base die to the substrate, and (b) secure the first stacked die to the base die.

1 - 45 . (canceled)  
     
     
         46 . A system for fabricating a stacked die assembly, comprising: 
 a first station having a first die storage mechanism containing plurality of flip-chip dies, a first dispense mechanism for preparing a substrate for receiving a flip-chip die, and a first die attach head for placing a front side of the flip-chip die on the substrate so that bond-pads on the front side face toward the substrate and a backside of the flip-chip die faces away from the substrate;    a second station proximate to the first station, the second station having a second storage mechanism containing a plurality of wire-bond dies, a second dispense mechanism for dispensing an adhesive onto the backside of the flip-chip die, and a second die attach head for mounting a backside of the wire-bond die to the backside of the flip-chip die; and    a transfer mechanism for transferring the base die mounted to the substrate directly to the second station in a single pass process.    
     
     
         47 . A system for fabricating a stacked die assembly, comprising: 
 a first station having a first die storage mechanism containing plurality of board-on-chip dies, a first dispense mechanism for preparing a substrate for receiving a board-on-chip die, and a first die attach head for placing a front side of the board-on-chip die on the substrate so that bond-pads on the front side face are aligned with a slot in the substrate and a backside of the board-on-chip die faces away from the substrate;    a second station proximate to the first station, the second station having a second storage mechanism containing a plurality of wire-bond dies, a second dispense mechanism for dispensing an adhesive onto the backside of the board-on-chip die, and a second die attach head for mounting a backside of the wire-bond die to the backside of the board-on-chip die; and    a transfer mechanism for transferring the base die mounted to the substrate directly to the second station in a single pass process.