Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold

Abstract

The specification discloses an apparatus comprising a die mounted on a substrate, the die being connected to the substrate by a plurality of wires, and a mold cap encapsulating the die and the plurality of wires, the mold cap comprising an electrically insulating portion encapsulating the wires and at least a portion of the die and a thermally conductive portion overmolded on the die and the electrically insulating portion. Also disclosed is a process comprising providing a die connected to a substrate by a plurality of wires, encapsulating the wires and at least a portion of the die in an electrically insulating material, and encapsulating the die, the wires and the electrically insulating material in a thermally conductive material. Other embodiments are disclosed and claimed.

1 . An apparatus comprising: 
 a stack of dies mounted on a substrate, the stack including a first die attached to the substrate and at least one additional die stacked thereon;    a plurality of wires connecting at least one of the stacked dies to the substrate or to another die in the stack; and    a mold cap encapsulating the wires and the stacked dies, the mold cap comprising an electrically insulating portion encapsulating substantially all of the wires and the entire stack of dies, and a thermally conductive portion encapsulating substantially all the electrically insulating portion.    
     
     
         2 . The apparatus of  claim 1  wherein at least one of the stacked dies comprises an integrated circuit.  
     
     
         3 . The apparatus of  claim 1  wherein the first die is flip-chip bonded to the substrate.  
     
     
         4 . The apparatus of  claim 1  wherein the electrically insulating material comprises a curable resin, a crosslinker, a catalyst, and a reinforcing filler.  
     
     
         5 . The apparatus of  claim 1  wherein the reinforcing filler comprises silica, alumina, zinc oxide, talc, or combinations thereof.  
     
     
         6 . The apparatus of  claim 1  wherein the resin comprises a curable resin, a crosslinker, a catalyst, and a metal filler.  
     
     
         7 . The apparatus of  claim 6  wherein the metal filler comprises aluminum, silver, copper, gold, or combinations or alloys thereof.  
     
     
         8 . The apparatus of  claim 1 , further comprising a heat dissipation device attached to, and in thermal contact with, the thermally conductive material.  
     
     
         9 . An apparatus comprising: 
 a stack of dies mounted on a substrate, the stack including a first die attached to the substrate and at least one additional die stacked thereon;    a plurality of wires connecting at least one of the stacked dies to the substrate or to another die in the stack; and    a mold cap encapsulating the wires and the stacked dies, the mold cap comprising: 
 an electrically insulating portion encapsulating substantially all the wires and the entire stack of dies, and  
 a thermally conductive portion encapsulating substantially all of the electrically insulating portion.  
   
     
     
         10 . The apparatus of  claim 9  wherein at least one of the stacked dies comprises an integrated circuit.  
     
     
         11 . The apparatus of  claim 9  wherein the first die is flip-chip bonded to the substrate.  
     
     
         12 . The apparatus of  claim 9  wherein the electrically insulating material comprises a curable resin, a crosslinker, a catalyst, and a reinforcing filler.  
     
     
         13 . The apparatus of  claim 9  wherein the reinforcing filler comprises silica, alumina, zinc oxide, talc, or combinations thereof.  
     
     
         14 . The apparatus of  claim 9  wherein the resin comprises a curable resin, a crosslinker, a catalyst, and a metal filler.  
     
     
         15 . The apparatus of  claim 14  wherein the metal filler comprises aluminum, silver, copper, gold, or combinations or alloys thereof.  
     
     
         16 . The apparatus of  claim 9 , further comprising a heat dissipation device attached to, and in thermal contact with, the thermally conductive material.