Inspection of electrical conductivity in composite materials

Abstract

Systems and methods for inspecting electrical conductivity in composite materials having conductive structures are disclosed. In one embodiment, a method for inspecting a conductive structure in a composite bonding region comprises positioning an apparatus operable to induce a current on the conductive structure. The apparatus is positioned on the conductive structure at a first selected position proximate to the bonding region. The method also comprises energizing the apparatus to provide a desired induced current in the conductive structure. The method further comprises detecting an impedance property value of the apparatus. Accordingly, the method additionally comprises positioning the apparatus at a second selected position if the impedance value is within a predetermined range of values. Alternatively, if the impedance value is not within the predetermined range, the method additionally comprises documenting the first selected position.

1 . A method of inspecting a conductive structure in a composite bonding region, comprising: 
 positioning an apparatus operable to induce a current into the conductive structure at a first selected position proximate to the bonding region;    energizing the apparatus to provide a desired induced current in the conductive structure;    detecting an impedance property value of the apparatus, and based upon the detected value:    if the impedance value is within a predetermined range of values, positioning the apparatus at a second selected position; and    if the impedance value is not within the predetermined range, documenting the first selected position.    
   
   
       2 . The method of  claim 1 , wherein positioning an apparatus operable to induce a current into the conductive structure further comprises: 
 positioning the apparatus on a reference material;    detecting a reference impedance value from the reference material, and based upon the detected value, selecting a desirable scale for impedance values detected while the apparatus is proximate to the bonding region.    
   
   
       3 . The method of  claim 1 , wherein energizing the apparatus further comprises providing an alternating current to the apparatus at a frequency that ranges between approximately about 50 Hertz (Hz) and approximately about 10 megahertz (MHz).  
   
   
       4 . The method of  claim 1 , wherein the apparatus further comprises a processor, and further wherein detecting an impedance property value comprises processing the value to generate at least one of a resistance, a reactance, a phasor magnitude and a phase angle.  
   
   
       5 . The method of  claim 1 , wherein detecting an impedance property value of the apparatus further comprises detecting the impedance property value using at least one of a coil positioned on the bonding region, and an auxiliary coil that is spaced apart from the coil positioned on the bonding region.