Light emitting apparatus and method for the same

Abstract

A light emitting apparatus includes a patterned conductive layer, a light emitting device on the patterned conductive layer, and a first light diffusion layer. The light emitting device and the patterned conductive layer are embedded in the first light diffusion layer. A method of forming such a light emitting apparatus is also disclosed.

1 . A method for forming a light emitting apparatus, comprising:
 providing a substrate;   forming a patterned conductive layer on said substrate;   disposing a light emitting device on said patterned conductive layer; and   forming a first light diffusion layer covering said substrate, so that said light emitting device and said patterned conductive layer are embedded in said first light diffusion layer.   
   
   
       2 . The method according to  claim 1 , further comprising removing said substrate to expose said patterned conductive layer after forming said first light diffusion layer. 
   
   
       3 . The method according to  claim 2 , further comprising forming a reflective layer on said patterned conductive layer after removing said substrate. 
   
   
       4 . The method according to  claim 1 , wherein said light emitting device comprises a light emitting diode. 
   
   
       5 . The method according to  claim 1 , further comprising utilizing a first injection mold to form a light-transparent layer covering said light emitting device prior to said step of forming said first light diffusion layer. 
   
   
       6 . The method accordingly to  claim 5 , wherein said light-transparent layer is an arc shape structure. 
   
   
       7 . The method according to  claim 5 , wherein said light-transparent layer is a wave shape structure. 
   
   
       8 . The method according to  claim 5 , wherein said light-transparent layer comprises a material selected from a group consisting of epoxy, silicone, acrylic resin, and fluorinated resin. 
   
   
       9 . The method according to  claim 1 , wherein said first light diffusion layer is formed by utilizing a second injection mold. 
   
   
       10 . The method according to  claim 9 , wherein said first light diffusion layer is formed with a rough surface defined by utilizing the second injection mold. 
   
   
       11 . The method according to  claim 1 , further comprising performing a plasma bombardment process on said first light diffusion layer to form a rough surface. 
   
   
       12 . The method of  claim 1 , wherein said first light diffusion layer comprises a material selected from a group consisting of polycarbonate, acrylate resin, copolymer of methyl acrylate and styrene, cyclic olefin copolymer, poly ethylene terephthalate and polystyrene. 
   
   
       13 . The method of  claim 1 , wherein said first light diffusion layer further includes at least one light diffusion particle therein and said light diffusion particle comprises a material selected from a group consisting of TiO 2 , SiO 2 , acrylate resin, polystyrene, and the combination thereof. 
   
   
       14 . The method of  claim 1 , further comprising utilizing a third injection mold to form a prism layer covering said first light diffusion layer. 
   
   
       15 . The method of  claim 14 , wherein said prism layer comprises a material selected from a group consisting of polycarbonate, acrylate resin, copolymer of acrylate and styrene, cyclic olefin copolymer, poly ethylene terephthalate and polystyrene. 
   
   
       16 . The method of  claim 14 , further comprising forming a second light diffusion layer covering said first light diffusion layer prior to said step of forming said prism layer. 
   
   
       17 . The method of  claim 16 , wherein said second light diffusion layer is formed by an evaporation process. 
   
   
       18 . The method of  claim 16 , wherein said second light diffusion layer comprises a material selected from a group consisting of TiO 2 , SiO 2 , acrylate resin, polystyrene. 
   
   
       19 . The method of  claim 1  further comprising forming an electronic device on said patterned conductive layer and embedded in said first light diffusion layer, wherein said electronic device is configured to control said light emitting device. 
   
   
       20 . The method of  claim 2 , further comprising a heat dissipation element contacting an exposed surface of said patterned conductive layer.