Polishing apparatus and manufacturing method of an electronic apparatus

Abstract

A polishing apparatus that polishes a substrate to be processed includes a rotary polishing table carrying a polishing pad on a surface thereof, and a polishing head that urges the substrate to be processed against the polishing pad while rotating the substrate to be processed, wherein the polishing head holds the substrate to be processed by a retainer ring, the retainer ring includes: a resin ring formed of a resin and contacted with the polishing pad; and an upper part ring that holds the resin ring, at least first and second patterns of convex shape or concave shape are formed on a junction surface of the upper part ring where the upper part ring is contacted with the resin ring, at least third and fourth patterns of concave shape or convex shape are formed on a junction surface of the resin ring where the resin ring makes contact with the upper electrode, in a manner complementary to the patterns of the convex shape or concave shape formed on the junction surface of the upper electrode.

1 . A polishing apparatus that polishes a substrate to be processed, comprising:
 a rotary polishing table carrying a polishing pad on a surface thereof; and   a polishing head that urges said substrate to be processed against said polishing pad while rotating said substrate to be processed,   wherein said polishing head holds said substrate to be processed by a retainer ring,   said retainer ring comprising: a resin ring formed of a resin and contacted with said polishing pad; and   
       an upper part ring that holds said resin ring,
 at least first and second patterns of convex shape or concave shape being formed on a junction surface of said upper part ring where said upper part ring is contacted with said resin ring, 
 at least third and fourth patterns of concave shape or convex shape being formed on a junction surface of said resin ring where said resin ring makes contact with said upper electrode, in a manner complementary to the said patterns of said convex shape or concave shape formed on said junction surface of said upper electrode. 
 
     
     
         2 . The polishing apparatus as claimed in  claim 1 , wherein said first and second patterns are formed on said junction surface of said upper ring respectively in a circumferential direction and in a radial direction, said third and fourth patterns are formed on said junction surface of said resin ring respectively in said circumferential direction and said radial direction. 
     
     
         3 . The polishing apparatus as claimed in  claim 2 , wherein said first pattern is formed on said junction surface of said upper ring so as to go around continuously along said upper ring, and wherein said third pattern is formed on said junction surface of said resin ring so as to go around contiguously along said resin ring. 
     
     
         4 . The polishing apparatus as claimed in  claim 1 , wherein said first and second patterns form plural pattern elements each extending on said junction surface of said upper ring in a radial direction, and wherein said third and fourth patterns form plural pattern elements each extending on said junction surface of said resin ring in a radial direction. 
     
     
         5 . The polishing apparatus as claimed in  claim 1 , wherein said first and second patterns form isolated patterns on said junction surface of said upper part ring, and wherein said third and fourth patterns form isolated patterns on said junction surface of said resin ring. 
     
     
         6 . The polishing apparatus as claimed in  claim 1 , wherein said resin ring and said upper part ring are connected with each other by adhering said respective junction surfaces by an adhesive. 
     
     
         7 . The polishing apparatus as claimed in  claim 1 , wherein said resin ring and said upper part ring are connected with each other by screws. 
     
     
         8 . A method for fabricating a semiconductor device, comprising a step of polishing a film formed on a substrate to be processed by using a polishing apparatus, said polishing apparatus comprising:
 a rotary polishing table carrying a polishing pad on a surface thereof; and   a polishing head that urges said substrate to be processed against said polishing pad while rotating said substrate to be processed,   wherein said polishing head holds said substrate to be processed by a retainer ring,   said retainer ring comprising: a resin ring formed of a resin and contacted with said polishing pad; and   
       an upper part ring that holds said resin ring,
 at least first and second patterns of convex shape or concave shape being formed on a junction surface of said upper part ring where said upper part ring is contacted with said resin ring, 
 at least third and fourth patterns of concave shape or convex shape being formed on a junction surface of said resin ring where said resin ring makes contact with said upper electrode, in a manner complementary to the said patterns of said convex shape or concave shape formed on said junction surface of said upper electrode.