Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

Abstract

A laminated circuit board has electronic components buried therein wherein the laminated circuit board may assure excellent reliability of electrical connections and high mechanical strength even with electronic components mounted in high density. It comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to integrated circuit or the like, and a sheet laminated on the upper surface of the substrate and also provided with a resin fluid filling portion formed by clearance at the outer periphery of integrated circuit or the like, wherein the sheet maintains its shape by woven or non-woven cloth having a hole in which integrated circuit or the like is buried, and the woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.

1 . A manufacturing method for a laminated circuit board with electronic component buried therein, comprising the steps of laminating a substrate on which a land disposed on one main surface thereon is connected and fixed to an electrode of electronic component by using a connecting and fixing material, and a first sheet laminated on one main surface of the substrate and provided with a filling portion by fluid resin at the outer periphery of the electronic component, and integrating the first sheet and the substrate by thermo-compression bonding after the laminating step, wherein the first sheet is provided with opening having clearance against the outer periphery of the electronic component at a portion corresponding to the electronic component and is formed from woven or non-woven cloth impregnated with resin having heat fluidity, and the first sheet and the substrate are integrated by thermo-compression bonding.  
     
     
         2 . The manufacturing method for a laminated circuit board of  claim 1 , wherein the first sheet and the substrate are thermally compressed at a temperature lower than the melting point of the connecting and fixing material.  
     
     
         3 . The manufacturing method for a laminated circuit board of  claim 1 , using thermosetting resin for the first sheet.  
     
     
         4 . The manufacturing method for a laminated circuit board of  claim 1 , wherein both of the substrate and the first sheet are formed of large worksheet with sub-substrates connected to each other.  
     
     
         5 . The manufacturing method for a laminated circuit board of  claim 4 , wherein the first sheet is formed by laminating a plurality of sheets whose thickness is greater than the height of electronic component, and copper foil is disposed on the whole or a part of the uppermost layer.  
     
     
         6 . The manufacturing method for a laminated circuit board of  claim 4 , wherein the electronic component is eccentric to the opening in the first sheet.  
     
     
         7 . The manufacturing method for a laminated circuit board of  claim 4 , wherein a high-frequency circuit including an inductor is formed on a substrate, and the first sheet opposing to the inductor is provided with a second opening, and the second opening is filled with a magnetic material.  
     
     
         8 . The manufacturing method for a laminated circuit board of  claim 4 , wherein a through-hole is provided at an end of the substrate and the first sheet after the integrating step, and a conductive pattern for a signal disposed on the substrate and the first sheet is led to the through-hole, and the through-hole serves as an end electrode.  
     
     
         9 . The manufacturing method for a laminated circuit board of  claim 4 , wherein a crosspiece is disposed between gathering of a plurality of sub-substrates and the other gathering provided adjoining the gathering.  
     
     
         10 . A manufacturing method for a laminated circuit board with electronic components buried therein, comprising the steps of laminating electronic component formed in pattern on one main surface of a substrate, and a first sheet having a filling portion by fluid resin above the electronic component, on the upper surface of the substrate, and integrating the first sheet and the substrate by thermo-compression bonding after the laminating step, wherein the first sheet is provided with opening around the electronic component at a portion corresponding to the electronic component and the first sheet is also provided with opening having clearance against the outer periphery of the electronic component, which is formed from woven or non-woven cloth impregnated with resin having heat fluidity, and the first sheet and the substrate are integrated by thermo-compression bonding.  
     
     
         11 . A manufacturing method for a module formed by separating sub-substrate from main substrate having a plurality of sub-substrates connected to each other, comprising the steps of laminating a substrate on which a land disposed on one main surface thereof is connected and fixed to an electrode of electronic component by using a connecting and fixing material, and a first sheet laminated on the upper surface of the substrate and provided with a filling portion by fluid resin at the outer periphery of the electronic component; thermo-compression bonding for integrating the first sheet and the substrate by thermal compression to form a laminated circuit board after the laminating step; component mounting for mounting components on one surface of the laminated circuit board after the thermo-compression bonding step; cover setting for setting a cover on the sub-substrate so as to cover the mounted components after the component mounting step; sheet affixing for affixing an adhesive sheet to the upper side of the cover to form a sheet part after the cover setting step; dividing for electrically Isolating the laminated circuit boards from each other and also dividing into sub-substrates mechanically connected by the adhesive sheet after the sheet affixing step; inspection for inspecting the sub-substrates after the dividing step; and peeling for removing the sub-substrate from the sheet after the inspection step, wherein the first sheet uses woven or non-woven cloth which is provided with opening having clearance against the outer periphery of the electronic component at a portion corresponding to the electronic component and a plate having resin soaked into the woven or non-woven cloth, and the resin used is resin having heat fluidity.  
     
     
         12 . The manufacturing method for a module of  claim 11 , wherein the dividing process is executed from the opposite side of the cover of the laminated circuit board.  
     
     
         13 . The manufacturing method for a module of  claim 11 , wherein the dividing process is executed with the cover side of the laminated circuit board up.  
     
     
         14 . The manufacturing method for a module of  claim 11 , wherein the adhesive sheet is formed of an outer frame and an adhesive sheet disposed in the outer frame.  
     
     
         15 . The manufacturing method for a module of  claim 11 , wherein the outer frame is provided with memory medium.  
     
     
         16 . The manufacturing method for a module of  claim 15 , wherein the identification number of the outer frame is stored in the memory medium.  
     
     
         17 . The manufacturing method for a module of  claim 11 , wherein sub-substrates accepted in the inspection process are removed in the peeling process.  
     
     
         18 . The manufacturing method for a module of  claim 17 , comprising a marking process for putting an identification mark on the upper surface of the cover after the peeling process.  
     
     
         19 . The manufacturing method for a module of  claim 18 , comprising a packaging process for packaging modules marked in the marking process.  
     
     
         20 . The manufacturing method for a module of  claim 11 , wherein the peeling process comprises a first step for placing a sheet part on a peeling block, a second step for touching a nozzle to the part to attract the part, a third process for releasing the air in a depression formed in the peeling block, and a fourth step for lifting the part with the nozzle.  
     
     
         21 . The manufacturing method for a module of  claim 20 , wherein the peeling process comprises a fifth step for making the air pressure in the depression equal to the outside pressure after the fourth step.  
     
     
         22 . The manufacturing method for a module of  claim 17 , comprising a second inspection process for inspecting sub-substrates remaining on a sheet after the peeling process, and a second peeling process for peeling sub-substrates accepted in the second inspection process.  
     
     
         23 . A manufacturing method for a module formed by separating sub-substrate from main substrate having a plurality of sub-substrates connected to each other, comprising the steps of laminating a substrate on which a land disposed on one main surface thereof. Is connected and fixed to an electrode of electronic component by using a connecting and fixing material, and a first sheet laminated on one main surface of the substrate and provided with a filling portion by fluid resin at the outer periphery of the electronic component; thermo-compression bonding for integrating the first sheet and the substrate by thermal compression to form a laminated circuit board; component mounting for mounting components on one surface of the laminated circuit board; cover setting for setting a cover on the sub-substrate so as to cover the mounted components; sheet affixing for affixing an adhesive sheet to the upper side of the cover to form a sheet part; dividing for electrically isolating the laminated circuit boards from each other and also dividing into sub-substrates mechanically connected by the adhesive sheet; laser trimming for adjusting coil inductor by laser trimming from the opposite surface of the component mounted surface of the laminated circuit board; inspection for inspecting the sub-substrate; and peeling for removing the sub-substrates from the sheet, wherein the first sheet uses plate-like woven or non-woven cloth impregnated with resin having heat fluidity which is provided with opening having clearance against the outer periphery of the electronic component at a portion corresponding to the electronic component.  
     
     
         24 . A module manufacturing device for manufacturing a module formed from main substrate having a plurality of sub-substrates connected to each other, comprising a laminated circuit board manufacturing device for manufacturing a laminated circuit board as the main substrate; a component mounting device for mounting components on one surface of the laminated circuit board; a cover setting device, disposed in the downstream from the component mounting device, for setting a cover on each of the sub-substrates so as to cover the component mounted by the component mounting device; a sheet affixing device, disposed in the downstream from the cover setting device, for affixing an adhesive sheet to the cover side; a dividing device, disposed in the downstream from the sheet affixing device, for dividing the sub-substrates; an inspecting device disposed in the downstream from the dividing device; and a peeling device, disposed in the downstream from the inspecting device, for removing the adhesive sheet, wherein the laminated circuit board manufacturing device has a substrate on which a land disposed on the upper surface thereof is connected and fixed to an electrode of electronic component by using a connecting and fixing material, and a first sheet laminated on the upper surface of the substrate and provided with a filling portion by fluid resin at an outer periphery of the electronic component, and the first sheet is provided with opening having clearance against the outer periphery of the electronic component at a portion corresponding to the electronic component and is formed from woven or non-woven cloth impregnated with resin having heat fluidity, and the first sheet and the substrate are integrated by thermo-compression bonding.  
     
     
         25 . The module manufacturing device of  claim 24 , wherein the sub-substrates are electrically isolated from each other by the dividing device while they are mechanically connected to each other by an adhesive sheet.  
     
     
         26 . The module manufacturing device of  claim 24 , wherein the cover setting device includes a component setting section, and the component setting section has a depression formed in a plate, and a component setting cassette having a faucet engagement portion to be fitted in the depression, wherein the plate is provided with a feed hole for fluid, and the bottom of the component setting cassette is provided with a hole disposed in a position opposing to the feed hole and tapered so as to narrow upward, and the component setting cassette is evenly push up by the fluid flowing out of the feed hole.  
     
     
         27 . The module manufacturing device of  claim 26 , wherein there are provided a plurality of tapered holes narrowing upward.  
     
     
         28 . The module manufacturing device of  claim 26 , wherein the faucet engagement portion to be fitted in the depression is tapered and widens upward.  
     
     
         29 . The module manufacturing device of  claim 26 , wherein the bottom of the faucet engagement portion is provided with an exhaust hole for fluid.  
     
     
         30 . The module manufacturing device of  claim 26 , wherein one end of a pipe is connected to the feed hole for fluid, and a valve connected to the exhaust hole for fluid and a pump is connected to the other end of the pipe.  
     
     
         31 . The module manufacturing device of  claim 26 , wherein there are provided a projection at the end of the plate, thereby forming a tray, and a component arranging portion which rotates nearly about the center of the tray for arranging the components.  
     
     
         32 . The module manufacturing device of  claim 24 , wherein the cover setting device includes a component inserting unit for mounting a cover on a laminated circuit board, and the component inserting unit comprises a slide portion with one side fixed on a horizontal member and the other side slidingly controlled in vertical direction, a plurality of nozzle blocks fixed on the other side of the slide portion, and a nozzle main body installed in such manner as to be vertically slidable against elasticity in the nozzle block, and there is provided a selective means capable of independently selecting the slide motion of the nozzle main body.  
     
     
         33 . The module manufacturing device of  claim 32 , wherein the selective means is formed of a selecting rod fixed on the nozzle main body, and a hole in which the selecting rod is selectively fitted.  
     
     
         34 . The module manufacturing device of  claim 33 , wherein holes are formed in a rotatable cylinder, and the cylinder is rotationally controlled.  
     
     
         35 . The module manufacturing device of  claim 34 , wherein a detecting means for detecting the rotating angle of the cylinder is disposed at the end of the cylinder.  
     
     
         36 . The module manufacturing device of  claim 34 , wherein the cylinder is attachable and detachable and replaceable.  
     
     
         37 . The module manufacturing device of  claim 32 , comprising a first elastic material which acts first on the nozzle main body when the nozzle block moves down, and a second elastic material which acts following the action of the first elastic material.  
     
     
         38 . The module manufacturing device of  claim 32 , wherein the horizontal member is slidingly controlled in horizontal direction.  
     
     
         39 . The module manufacturing device of  claim 38 , wherein a table is disposed horizontally under the nozzle main body and its movement is controllable in a direction vertical to the moving direction of the horizontal member.  
     
     
         40 . The module manufacturing device of  claim 24 , wherein the cover setting device includes a component inserting unit for mounting a cover on a laminated circuit board, and the component inserting unit comprises a slide portion with one side fixed on a horizontal member and the other side slidingly controlled in vertical direction, a plurality of nozzle blocks half fixed on the other side of the slide portion, and a nozzle main body installed in such manner as to be vertically slidable against elasticity in the nozzle block, and the nozzle block is slid on the other side of the slide portion, and the nozzle block is fixed at a proper position on the slide portion.  
     
     
         41 . The module manufacturing device of  claim 24 , wherein the peeling device comprises a peeling block on which an adhesive sheet with components affixed thereto is placed, a depression formed in the peeling block at a position corresponding to the component, a pin disposed in the depression and abutted nearly on the center of the component via the adhesive sheet, an air vent hole disposed in the depression, a vacuum pump connected to the air vent hole, and a nozzle disposed so as to abut a part of the component.  
     
     
         42 . The module manufacturing device of  claim 41 , wherein the abutment of the pin abutting the adhesive sheet is semi-circular.  
     
     
         43 . The module manufacturing device of  claim 41 , wherein the tip of the pin is lower than the top of the peeling block.  
     
     
         44 . The module manufacturing device of  claim 41 , wherein the nozzle is provided with an elastic material which pushes the component with a predetermined pressure.  
     
     
         45 . The module manufacturing device of  claim 41 , wherein a depression is provided corresponding to a row of sheet components with components placed in a state of in-line arrangement on the adhesive sheet, and there are provided a pin and a nozzle corresponding to the row of components.  
     
     
         46 . The module manufacturing device of  claim 41 , wherein depressions are provided corresponding to a plurality of rows of sheet components with components placed in a state of in-line arrangement on the adhesive sheet, and there are provided pins and nozzles corresponding to the plurality of rows of components.  
     
     
         47 . The module manufacturing device of  claim 41 , wherein a depression is provided corresponding to one piece of sheet components with components placed in a state of in-line arrangement on the adhesive sheet, and there are provided a pin and a nozzle corresponding to the one component.  
     
     
         48 . The module manufacturing device of  claim 41 , wherein the depression corresponding to the sheet component with components placed in a state of in-line arrangement on the adhesive sheet is sized so as to intrude in a range from one second to one third of the size of component adjoining the pin.  
     
     
         49 . The module manufacturing device of  claim 48 , wherein there is provided a guide which is partially in contact with the component adjoining the pin.  
     
     
         50 . The module manufacturing device of  claim 41 , wherein a suction hole for attracting the adhesive sheet is provided at top of the peeling block.