US2008078530A1PendingUtilityA1
Loop heat pipe with flexible artery mesh
Est. expiryOct 2, 2026(~0.2 yrs left)· nominal 20-yr term from priority
H10W 40/73F28D 15/043
41
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Claims
Abstract
A loop heat pipe ( 10 ) includes an evaporator ( 11 ) thermally connected with a heat generating electronic component and including a wick structure ( 112 ) disposed therein, a condenser ( 12 ) thermally connected with a heat dissipating component, a vapor line ( 13 ) and a liquid line ( 14 ) connecting the evaporator with the condenser to form a closed loop, a predetermined quantity of bi-phase working medium contained in the closed loop, and an artery mesh ( 15 ) located within the liquid line.
Claims
exact text as granted — not AI-modified1 . A loop heat pipe comprising:
an evaporator configured for thermally connecting with a heat generating electronic component and comprising a wick structure disposed therein; a condenser configured for thermally connecting with a heat dissipating component; a vapor line and a liquid line connecting the evaporator with the condenser to form a closed loop; a predetermined quantity of bi-phase working medium filled in the closed loop; and an artery mesh positioned within the liquid line.
2 . The loop heat pipe of claim 1 , wherein the artery mesh has a linear contact with an inner wall of the liquid line.
3 . The loop heat pipe of claim 1 , wherein a diameter of a cross section of the artery mesh is smaller than that of the liquid line.
4 . The loop heat pipe of claim 1 , wherein the artery mesh is a flexible hollow tube woven from a plurality of metal wires.
5 . The loop heat pipe of claim 4 , wherein the material of the metal wires is selected from a group consisting of copper wires and stainless steel wires.
6 . The loop heat pipe of claim 1 , wherein the artery mesh is formed by weaving a plurality of fiber together.
7 . The loop heat pipe of claim 1 , wherein the wick structure is selected from the group consisting of grooves, sintered powder, fiber and screen mesh.
8 . The loop heat pipe of claim 1 , wherein the wick structure is tubular shaped in profile and disposed in an inner wall of the evaporator.
9 . The loop heat pipe of claim 1 , wherein the wick structure has a closed end contacting with the liquid line and an open end communicating with the vapor line, a vapor channel being defined in a middle portion of the open end.
10 . A loop heat pipe comprising:
an evaporator configured for thermally connecting with a heat generating electronic component and comprising a wick structure disposed therein; a condenser configured for thermally connecting with a heat dissipating component; a vapor line connecting an open end of the wick structure with the condenser; a liquid line connecting a closed end of the wick structure with the condenser; a vapor channel defined in a middle portion of the open end of the wick structure and communicating with the vapor line; an artery mesh positioned within the liquid line; and a predetermined quantity of bi-phase working medium contained in the loop heat pipe.
11 . The loop heat pipe of claim 10 , wherein the artery mesh is a hollow tube in contact with an inner wall of the liquid line.
12 . The loop heat pipe of claim 10 , wherein a diameter of a cross section of the artery mesh is smaller than that of the liquid line.
13 . The loop heat pipe of claim 10 , wherein the artery mesh is woven from a plurality of metal wires selected from a group consisting of copper and stainless steel wires.
14 . The loop heat pipe of claim 10 , wherein the artery mesh is tightly attached to inner walls of the liquid line.
15 . The loop heat pipe of claim 10 , wherein the wick structure has a column shaped outer wall contacting with an inner wall of the evaporator.
16 . The loop heat pipe of claim 10 , wherein a diameter of the vapor channel is larger than a diameter of an inner wall of the vapor line.Join the waitlist — get patent alerts
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