Thermoelectric device with internal sensor

Abstract

A thermoelectric system which comprises two substrates spaced apart from each other to form a gap and a plurality of electrically-connected semiconductor elements disposed between the substrates in the gap. The thermoelectric system further comprises at least one sensor and a seal which extends between the substrates and encloses the sensor and at least one of the plurality of semiconductor elements. The sensor is disposed between the substrates at an interior location spaced from the peripheral edge of at least one of the substrates. Additionally, at least one of the semiconductor elements is disposed between the sensor and the peripheral edge.

1 . A thermoelectric device comprising:
 a first and a second substrate spaced apart from each other to form a gap;   a plurality of semiconductor elements disposed between the first and second substrates within the gap, the plurality of semiconductor elements comprising a first group of semiconductor elements having a first set of electrical properties and a second group of semiconductor elements having a second set of electrical properties;   a first set of electrical conductors disposed between the plurality of semiconductors and the first substrate and a second set of electrical conductors disposed between the plurality of semiconductors and the second substrate, the first set of electrical conductors and the second set of electrical conductors arranged so the plurality of semiconductor elements are electrically coupled to each other in series with the first and second groups of semiconductor elements in an alternating arrangement;   at least one sensor disposed between the first and second substrates at a location spaced from a peripheral edge of the first and second substrates; and   a seal extending around the peripheral edge of the first and second substrates.   
   
   
       2 . The thermoelectric system of  claim 1 , wherein the sensor is a temperature sensor. 
   
   
       3 . The thermoelectric system of  claim 1 , wherein the sensor comprises a thermistor. 
   
   
       4 . The thermoelectric system of  claim 1 , wherein the sensor comprises a thermocouple. 
   
   
       5 . The thermoelectric system of  claim 1 , wherein the substrates have a substantially rectangular shape. 
   
   
       6 . The thermoelectric system of  claim 1 , wherein the sensor is disposed, with respect to the peripheral edge, at substantially the center of one of the substrates 
   
   
       7 . The thermoelectric system of  claim 1 , wherein the sensor is disposed between two of the plurality of semiconductor elements. 
   
   
       8 . The thermoelectric system of  claim 1 , further comprising at least one heat transfer member coupled to at least one of the substrates. 
   
   
       9 . The thermoelectric system of  claim 8 , wherein the heat transfer member comprises a plurality of fins. 
   
   
       10 . The thermoelectric system of  claim 1 , wherein the seal completely encloses all of the plurality of semiconductor elements positioned between the substrates. 
   
   
       11 . A thermoelectric system comprising:
 a pair of opposing substrates, each substrate having a peripheral edge and a face that generally opposes a face of the other opposing substrate;   a plurality semiconductor elements are positioned between the opposing faces of the opposing substrates, the plurality of semiconductor elements comprises at least two groups of dissimilar semiconductor elements, the plurality of semiconductor elements electrically coupled in series by conductor elements arranged so the two groups of dissimilar semiconductor elements are connected in an alternating pattern;   a sensor positioned between the pair of opposing substrates at a location spaced from the peripheral edges of the opposing substrates; and   a seal extending around the plurality of semiconductor elements.   
   
   
       12 . The thermoelectric system of  claim 10 , wherein the sensor is configured to detect temperature. 
   
   
       13 . The thermoelectric system of  claim 10 , wherein the sensor comprises a thermistor. 
   
   
       14 . The thermoelectric system of  claim 10 , wherein the sensor comprises a thermocouple. 
   
   
       15 . The thermoelectric system of  claim 10 , wherein the seal is composed of silicone rubber. 
   
   
       16 . The thermoelectric system of  claim 10 , wherein the substrates have a substantially rectangular shape. 
   
   
       17 . A climate controlled seat assembly, comprising:
 a seat cushion having an outer surface comprising a first side for supporting an occupant in a sitting position and a second side;   an air passage extending from the second side into the seat cushion and is configured to deliver air to the first side of the seat cushion;   a climate control system in fluid communication with the air passage, the climate control system including a thermoelectric device configured to heat and cool air deliver to the air passage, the thermoelectric device including a pair of opposing substrates, a plurality of semiconductor and connection elements disposed between the opposing substrates, a sensor disposed between the pair of opposing substrates, and a seal extending around the plurality of semiconductor and connection elements and the sensor.   
   
   
       18 . The thermoelectric system of  claim 15 , wherein the sensor is configured to detect temperature. 
   
   
       19 . The thermoelectric system of  claim 16 , wherein the sensor comprises a thermistor. 
   
   
       20 . The thermoelectric system of  claim 15 , wherein the thermoelectric device further comprises at least one heat transfer member coupled to one of the opposing substrates. 
   
   
       21 . The thermoelectric system of  claim 15 , wherein the thermoelectric device further comprises at least one heat transfer member coupled to each of the opposing substrates. 
   
   
       22 . A thermoelectric system comprising:
 a pair of opposing substrates, each substrate having a peripheral edge and a face that generally opposes a face of the other opposing substrate;   a plurality semiconductor elements disposed between the opposing substrates, the plurality of semiconductor elements comprising at least two groups of dissimilar semiconductor elements that are alternately electrically coupled to each other in series;   a sensor positioned between the pair of opposing substrates at a location spaced from the peripheral edges of the opposing substrates; and   means for sealing from moisture the plurality of semiconductor elements and the sensor positioned between the pair of opposing substrates.