Heat transfer for a hard-drive pre-amp

Abstract

A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.

1 . A substrate for mounting a preamp chip thereupon, comprising:
 a stiffener layer made of first conductive material;   an insulating layer provided over circuitry area of said substrate;   a circuitry of a second conductive material provided over said insulating layer;   a flap comprising an extension of said stiffener layer having no insulating layer provided thereupon, and wherein said flap is fabricated to fold over said preamp chip.   
   
   
       2 . The substrate of  claim 1 , wherein said first conductive material comprises stainless steel. 
   
   
       3 . The substrate of  claim 1 , wherein said second conductive material comprises copper. 
   
   
       4 . The substrate of  claim 1 , wherein said flap comprises fins. 
   
   
       5 . The substrate of  claim 1 , wherein said flap comprises cutout configured for injective adhesive thereupon. 
   
   
       6 . An actuator assembly for a hard disk drive, comprising:
 an actuator arm;   a circuitry substrate mounted onto said arm;   a preamp chip mounted onto said circuitry substrate; and,   wherein said substrate comprises a flap folded over top of said preamp ship.   
   
   
       7 . The assembly of  claim 6 , wherein said substrate comprises:
 a stiffener layer made of first conductive material;   an insulating layer provided over circuitry area of said substrate;   a circuitry of a second conductive material provided over said insulating layer; and,   wherein said flap comprises an extension of said stiffener layer having no insulating layer provided thereupon.   
   
   
       8 . The assembly of  claim 6 , further comprising an adhesive provided between said preamp chip and said flap. 
   
   
       9 . The assembly of  claim 6 , wherein said flap comprises a cutout and wherein said assembly further comprises an adhesive injected via said cutout. 
   
   
       10 . The assembly of  claim 9 , wherein said adhesive comprises a heat conducting epoxy. 
   
   
       11 . The assembly of  claim 6 , wherein said flap comprises fins. 
   
   
       12 . A method for manufacturing a substrate for supporting an integrated circuit chip thereupon, comprising:
 providing a sheet of stiffener comprising a first conductive material;   providing an insulating layer on defined sections of said stiffener, each section defining a circuitry area of one substrate;   providing contacts on said insulating layer, said contacts made of a second conductive material; and,   cutting each substrate out of said sheet according to a designed outline, said designed outlined comprising said circuitry area and a flap, said flap comprising a section of said sheet of stiffener having no insulating layer thereupon.   
   
   
       13 . The method of  claim 12 , further comprising cutting a cutout in said flap. 
   
   
       14 . A method for manufacturing a preamp assembly for a hard drive, comprising:
 providing a substrate, said substrate comprising a stiffener conductive layer, an insulating layer provided on the stiffener and defining a circuitry area, and a plurality of contacts provided on said insulating layer, and a flap comprising a section of the stiffener having no insulating layer thereupon;   mounting the preamp on the circuitry area of the substrate so as to form electrical connection to at least some of the contacts; and   folding the flap over the preamp.   
   
   
       15 . The method of  claim 14 , further comprising injective adhesive between the preamp and the flap. 
   
   
       16 . The method of  claim 14 , wherein said flap comprises a cutout and wherein the method further comprises injecting adhesive onto the cutout. 
   
   
       17 . The substrate of  claim 1 , wherein said first conductive material comprises aluminum.