Connection apparatus for circuit board, ink jet type recording apparatus using the same, ic chip and ink cartridge having ic chip

Abstract

A circuit board on an ink cartridge has contact pads which are electrically conducted to a semiconductor storage element mounted on the circuit board. Connector terminals on an ink jet recording apparatus are brought into relative slide contact with a surface of this circuit board, and electrically connected to the contact pads. When the connector terminals come in contact with the contact pads, the dust adhering to the connector terminals is wiped and removed by step portions that are constituted by no-resist-film formation parts and that are adjacent to the contact pads. Consequently, the reliability of the electrical contact between the connector terminals and the contact pads is ensured.

1 . (canceled)  
   
   
       2 . An IC chip comprising: 
 a substrate;    a contact pad on a first surface of the substrate, and to be connected to a connector terminal that is adapted to be come in sliding contact with the contact pad;    a resist film portion on the first surface of the substrate;    a memory device on a second, opposite surface of the substrate, the memory device being electrically connected to the contact pad;    a non-resist film portion exposing the first surface of the substrate, wherein the non-resist film portion and the contact pad define a step therebetween, and    the step is located at least one of an upstream side and a downstream side of the contact pad in a connecting direction in which the connector terminal is contacted to the contact pad.    
   
   
       3 . The IC chip according to  claim 2 , wherein 
 the step includes a first step and a second step which are located at the upstream side and the downstream side of the contact pad in the connecting direction, respectively.    
   
   
       4 . A circuit board comprising: 
 a substrate, a contact pad on a first surface of the substrate, and to be connected to a connector terminal that is adapted to be come in sliding contact with the contact pad;    a resist file portion on the first surface of the substrate; and    a non-resist film portion exposing the first surface of the substrate, wherein the non-resist film portion and the contact pad define a step therebetween; and    the step down is located at least one of an upstream side and a downstream side of the contact pad in a connecting direction in which the connector terminal is contacted to the contact pad.    
   
   
       5 . The circuit board according to  claim 4 , wherein 
 the step includes a first step and a second step which are located at the upstream side and the downstream side of the contact pad in the connecting direction, respectively.    
   
   
       6 . The circuit board according to  claim 4 , wherein 
 the step is located at the upstream side of the contact pad in the connecting direction.    
   
   
       7 . The circuit board according to  claim 4 , wherein 
 the non-resist film portion is arranged between the contact pad and the resist film portion in the connecting direction.    
   
   
       8 . The circuit board according to  claim 4 , wherein 
 the contact pad and the resist film portion are in a plane with each other.    
   
   
       9 . A circuit board comprising: 
 a substrate;    a plurality of contact terminals on a first surface of the substrate, and to be connected to a plurality of connector terminals that are adapted to be slid on a sliding path to contact with the contact terminals;    a resist film portion formed on the sliding path on the first surface of the substrate; and    a non-resist film portion adjacent to the contact terminals on the sliding path,    wherein the non-resist film portion and contact terminals define a step therebetween.    
   
   
       10 . A circuit board comprising: 
 a substrate;    a contact pad on the substrate, and to be connected to a connector terminal that is adapted to be slid on a sliding path to contact with the contact pad;    a resist film portion on the sliding path on the substrate, on which a resist film is formed; and    a non-resist film portion arranged between the contact pad and the resist film portion, on which a resist film is not formed, wherein    the non-resist film portion and the contact pad define a step therebetween, and    the step is located at an upstream side of the contact pas in a connecting direction in which the connector terminal is contacted to the contact pad.    
   
   
       11 . The circuit board according to  claim 10 , wherein 
 the non-resist film portion includes a through hole in which a pattern connected to the contact pad is provided.    
   
   
       12 . A circuit board comprising: 
 a substrate;    a contact pad on the substrate, and to be connected to a connector terminal that is adapted to be slid on a sliding path to contact with the contact pad;    a resist film portion on the sliding path on the substrate, on which a resist film is formed; and    a non-resist film portion arranged between the contact pad and the resist-film portion, on which a resist film is not formed, wherein    the resist film portion and the non-resist film portion define a step therebetween, and the step is located at an upstream side of the contact pad in a direction in which the connector terminal is contacted to the contact pad.    
   
   
       13 . The circuit board according to  claim 12 , wherein 
 the non-resist film portion includes a pattern connected to the contact pad.