US2008092556A1PendingUtilityA1
Cryogenic Cooling Device
Assignee: TARGET SYSTEMELECTRONIC GMBHPriority: Jul 28, 2004Filed: Jul 28, 2005Published: Apr 24, 2008
Est. expiryJul 28, 2024(expired)· nominal 20-yr term from priority
F25D 19/006F25D 2303/085F25D 3/00
44
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Claims
Abstract
The present invention relates to a cryo temperature cooling device ( 1 )comprising 5 a tank ( 2 ), being filled up at least in part with a coolant ( 3 ), and a heat conducting element ( 4 ), whereas the heat conducting element ( 4 ) can be brought into thermal contact with the coolant ( 3 ), so that the coolant has a phase transition occurring below a temperature of −100° C., so that the cryogenic cooling device more or less consumes no coolant during operation.
Claims
exact text as granted — not AI-modified1 . Cryo temperature cooling device comprising a tank, being filled up at least in part with a coolant, and a heat conducting element, whereas the heat conducting element can be brought into thermal contact with the coolant, characterized in that the coolant has a phase transition occurring below a temperature of −100° C., so that the cryogenic cooling device more or less consumes no coolant during operation.
2 - 25 . (canceled)
26 . Measurement device, comprising a detector and a cryo temperature cooling device according to claim 1 for cooling the detector, comprising at least one of the following features:
the measurement device is set up as a portable handheld device, the measurement device is set up as a spectrometer, the detector comprises a semiconductor detector, preferably using germanium, for the measurement of ionizing radiation, at least one cooling finger of the cryo temperature cooling device is in thermal contact to the detector.
27 - 41 . (canceled)
42 . Cooling device for the cooling down of a cryo temperature cooling device according to claim 1 , characterized in that the cooling device for the cooling down of the cryo temperature cooling device can be connected thermally with said cryo temperature cooling device and where the cooling down is provided mainly via said thermal connection and mainly without material exchange between cooling device and the cryo temperature cooling device to be cooled down.
43 . (canceled)
44 . (canceled)Join the waitlist — get patent alerts
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