Isothermal imprint embossing system

Abstract

Isothermal imprint embossing system. In one embodiment, the system includes a heater to pre-heat a disk substrate to an embossing temperature, a die assembly with an embossing foil to imprint the embossable film disposed on the disk substrate, and a heat tunnel disposed between the heater and the die assembly to maintain the embossing temperature.

1 . A method, comprising: 
 pre-heating an embossable film disposed above a substrate to approximately an embossing temperature; and    transporting the substrate through a heat tunnel to a die assembly to imprint an embossable film, the heat tunnel to maintain the embossing temperature.    
   
   
       2 . The method of  claim 1 , further comprising centering the substrate relative to an embossing foil within the die assembly.  
   
   
       3 . The method of  claim 1 , wherein pre-heating further comprises placing the substrate in an oven disposed adjacent to the die assembly.  
   
   
       4 . The method of  claim 1 , wherein transporting further comprises picking up the substrate with a vacuum chuck coupled to a robotic arm disposed near the die assembly.  
   
   
       5 . The method of  claim 1 , wherein transporting further comprises sliding the substrate through the heat tunnel with a servo slide.  
   
   
       6 . The method of  claim 5 , further comprising centering the substrate relative to an embossing foil within the die assembly.  
   
   
       7 . The method of  claim 5 , wherein transporting further comprises gripping the substrate with flexure joints.  
   
   
       8 . The method of  claim 2 , wherein centering further comprises heating a ball bushing disposed within the die assembly to hold a precise alignment between the embossing foil and the substrate.  
   
   
       9 . The method of  claim 2 , further comprising pressing the embossing foil into the embossable film of the substrate.  
   
   
       10 . The method of  claim 9 , further comprising inspecting an embossed pattern on the embossable film.  
   
   
       11 . The method of  claim 9 , wherein inspecting further comprises placing the substrate under a microscope to inspect an embossed pattern on the embossable film.  
   
   
       12 . The method of  claim 9 , further comprising cooling the substrate.