US2008102741A1PendingUtilityA1

Single-layer polishing pad

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Assignee: IV TECHNOLOGIES CO LTDPriority: May 5, 2004Filed: Dec 26, 2007Published: May 1, 2008
Est. expiryMay 5, 2024(expired)· nominal 20-yr term from priority
B24D 11/001B24B 37/24B24D 3/32
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Claims

Abstract

A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.

Claims

exact text as granted — not AI-modified
1 . A single-layer polishing pad, comprising: 
 a body comprising a porous polymer;    a polishing surface, having at least a first region and at least a second region over different areas, on one side of the body, wherein the density of the first region is lower than the density of the second region; and    a mounting surface on another side of the body.    
     
     
         2 . The single-layer polishing pad of  claim 1 , wherein the density of the first region of the polishing surface is higher than the density of the mounting surface.  
     
     
         3 . The single-layer polishing pad of  claim 1 , wherein a shape of the first region is a sector, a ring or a circle.

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