Polyketone Fiber Paper, Polyketone Fiber Paper Core Material For Printed Wiring Board, And Printed Wiring Board
Abstract
An aliphatic polyketone fiber paper comprising aliphatic polyketone fibers and a polyketone fiber paper core material for a printed wiring board are provided. The polyketone fiber paper and the core material have high strength and modulus of elasticity; excellent dimensional stability, chemical resistance, heat resistance, adhesiveness and electrical insulation; and low dielectricity and water absorbance, and are thin, porous, and uniform. A printed wiring board prepared from the core material having a low dielectric constant, dimensional stability, electrical insulation, and properties of being uniformly bored by laser punching is also provided. The aliphatic polyketone fiber paper and the core material for a printed wiring board comprises 1 to 100% by mass of aliphatic polyketone fibers which comprise the repeating unit of the below-mentioned formula (1), the fibers having an average fiber length of 0.5 to 10 mm, an average fiber diameter of 0.1 to 20 μm, a thickness of 5 to 200 μm, a void ratio of 30 to 90%, and a strength per unit mass of 100 MN/kg or more. Also provided is a single layer or multilayer printed wiring board which comprises a core material impregnated or coated with a polymer resin, a low dielectric polymer resin, or a polyphenylene ether-based epoxy resin. —CH 2 —CH 2 —CO— (1)
Claims
exact text as granted — not AI-modified1 . A polyketone fiber paper comprising 1 to 100% by mass of aliphatic polyketone fibers which comprise the repeating unit of the following formula (1), wherein the polyketone fiber paper is produced by a wet process.
—CH 2 —CH 2 —CO— (1)
2 . A polyketone fiber paper comprising 1 to 99% by mass of aliphatic polyketone fibers which comprise the repeating unit of the following formula (1), wherein the polyketone fiber paper is produced by a wet process.
—CH 2 —CH 2 —CO— (1)
3 . A polyketone fiber paper comprising aliphatic polyketone fibers which comprise the repeating unit of the following formula (1), wherein the polyketone fiber paper is produced by a wet process.
—CH 2 —CH 2 —CO— (1)
4 . The polyketone fiber paper according to any one of claims 1 to 3 , having a thickness of 5 to 200 μm.
5 . The polyketone fiber paper according to any one of claims 1 to 3 , having a thickness of 5 to 100 μm.
6 . The polyketone fiber paper according to any one of claims 1 to 3 , having a thickness of 5 to 50 μm.
7 . The polyketone fiber paper according to any one of claims 1 to 6 , having a void ratio shown by the following formula of 30 to 90%.
Void ratio=(1−total mass of fibers forming the fiber paper/density of the fibers/(thickness of fiber paper×area of fiber paper))×100
8 . The polyketone fiber paper according to any one of claims 1 to 7 , wherein the strength per unit mass of the fiber paper is 100 MN/kg or more, wherein the strength per unit mass is tensile strength/thickness/basis weight.
9 . The polyketone fiber paper according to any one of claims 1 to 7 , wherein the strength per unit mass of the fiber paper is 200 MN/kg or more, wherein the strength per unit mass is tensile strength/thickness/basis weight.
10 . The polyketone fiber paper according to any one of claims 1 to 7 , wherein the strength per unit mass of the fiber paper is 400 MN/kg or more, wherein the strength per unit mass is tensile strength/thickness/basis weight.
11 . The polyketone fiber paper according to any one of claims 1 to 10 , wherein the polyketone fibers are staple fibers with an average fiber length of 0.5 to 10 mm.
12 . The polyketone fiber paper according to any one of claims 1 to 11 , wherein the polyketone fibers have an average diameter of 1 to 20 μm.
13 . A polyketone fiber paper core material for a printed wiring board comprising the polyketone fiber papers according to any one of claims 1 to 12 .
14 . The polyketone fiber paper core material for a printed wiring board according to claim 13 , wherein the polyketone fiber paper is used in a single layer or multiple layers.
15 . A printed wiring board comprising the polyketone fiber paper core material according to claim 13 or 14 and a polymer resin.
16 . The printed wiring board according to claim 15 , wherein the polyketone fiber paper core material is impregnated or coated with the polymer resin.
17 . The printed wiring board according to claim 15 or 16 , wherein the polymer resin is a low dielectric polymer resin.
18 . The printed wiring board according to any one of claims 15 to 17 , wherein the polymer resin is a polyphenylene ether-based epoxy resin comprising polyphenylene ether substituted with or containing an epoxy group in an average amount of one or more per molecule and at least one curing agent selected from the group consisting of an amine, a novolak phenol, and an acid anhydride as essential components.
19 . The printed wiring board according to any one of claims 15 to 18 , wherein the printed wiring board is a single layer board or a multilayer board.
20 . A method for producing an aliphatic polyketone fiber paper comprising preliminarily refining aliphatic polyketone fibers, crushing the refined aliphatic polyketone fibers, and making paper from the crushed aliphatic polyketone fibers.
21 . The method for producing an aliphatic polyketone fiber paper according to claim 20 , wherein the preliminary refining comprises a treatment using a beater or a refiner.
22 . The method for producing an aliphatic polyketone fiber paper according to claim 20 , wherein the crushing comprises a treatment using a high pressure homogenizer.Cited by (0)
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