Rotary Die Board
Abstract
An arcuate die board formed as a multi-layered paperboard structure. The die board is initially produced as a full cylindrical paperboard tube, which is subsequently cut lengthwise to form two or more part-cylindrical portions each of which is used to fabricate a die board. The die board is then cut to form the slots in its outer surface for mounting die tools. The multi-layered paperboard tube can be spirally wound, convolutely wound, or formed by a linear draw process. The part-cylindrical wall is formed predominantly, substantially entirely, or entirely of paperboard plies adhesively laminated together.
Claims
exact text as granted — not AI-modified1 . A die board for a rotary die, comprising:
an arcuate part-cylindrical wall having an outer part-cylindrical surface and an inner part-cylindrical surface; and wherein the part-cylindrical wall is formed at least predominantly of a plurality of paperboard plies adhesively laminated together.
2 . The die board of claim 1 , further comprising a plurality of slots formed in the outer part-cylindrical surface of the wall for receiving die tools.
3 . The die board of claim 1 , wherein the part-cylindrical wall is formed substantially entirely of a plurality of paperboard plies adhesively laminated together.
4 . The die board of claim 1 , wherein the inner part-cylindrical surface has a diameter of approximately 482 to 489 mm.
5 . The die board of claim 4 , wherein the part-cylindrical wall has a thickness of approximately 12.6 to 13.3 mm.
6 . The die board of claim 1 , wherein the plurality of paperboard plies include paperboard plies of at least two different types.
7 . The die board of claim 1 , wherein an outermost ply of the die board is substantially thinner than at least some of the other plies.
8 . The die board of claim 1 , wherein the plies include at least a first moisture-barrier ply.
9 . The die board of claim 8 , wherein the first moisture-barrier ply comprises a laminate of at least one paper layer and at least one substantially moisture-impervious layer.
10 . The die board of claim 8 , wherein the first moisture-barrier ply is proximate a radially outer surface of the die board.
11 . The die board of claim 10 , further comprising a second moisture-barrier ply proximate the radially outer surface of the die board.
12 . The die board of claim 9 , wherein the first moisture-barrier ply is proximate a radially inner surface of the die board.
13 . The die board of claim 12 , further comprising a second moisture-barrier ply proximate a radially outer surface of the die board.
14 . The die board of claim 13 , further comprising a third moisture-barrier ply located radially inwardly of the first and second moisture-barrier plies.
15 . The die board of claim 13 , wherein there is a substantially greater number of paperboard plies than moisture-barrier plies.
16 . The die board of claim 1 , comprising approximately 15 to 25 paperboard plies ranging in thickness from about 0.01 inch to about 0.03 inch, the die board having a wall thickness of about 0.4 to 0.6 inch.
17 . A method for making die boards for a rotary die, comprising the steps of:
wrapping a plurality plies, predominantly made up of a plurality of paperboard plies, one atop another about a cylindrical mandrel and adhering the plies to one another to form a hollow predominantly paperboard tube on the mandrel; removing the tube from the mandrel; and cutting the tube lengthwise to form at least two part-cylindrical portions each formed by a part-cylindrical wall having a part-cylindrical inner surface and a part-cylindrical outer surface.
18 . The method of claim 17 , further comprising the step of:
forming a pattern of slots in the part-cylindrical outer surface of each of the part-cylindrical portions, the slots being configured to hold die tools.
19 . The method of claim 17 , wherein the wrapping step comprises helically wrapping the plies about the cylindrical mandrel.
20 . The method of claim 17 , wherein the wrapping step comprises wrapping plies of at least two different types.
21 . The method of claim 17 , wherein the wrapping step includes wrapping at least one moisture-barrier ply.
22 . The method of claim 17 , wherein the wrapping step includes wrapping at least one moisture-barrier ply in the form of a laminate having at least one paper layer and at least one substantially moisture-impervious layer.
23 . The method of claim 22 , wherein the wrapping step includes wrapping at least two of said moisture-barrier plies each in the form of said laminate.
24 . The method of claim 17 , wherein the wrapping step includes wrapping a plurality of paperboard plies having a moisture content not greater than about 4%.
25 . The method of claim 24 , wherein the wrapping step further comprises wrapping at least one moisture-barrier ply in the form of a laminate having at least one paper layer and at least one substantially moisture-impervious layer.Join the waitlist — get patent alerts
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