Loading a Socket and/or Adapter Device with a Semiconductor Component

Abstract

A process, device and a mechanism for loading a socket and/or adapter device with a semiconductor component is disclosed. The mechanism has a device, in particular a mechanical device, for instance an appropriate attachment, for opening the socket and/or adapter device.

1 . A mechanism for loading a socket with a semiconductor component, comprising a device for opening the socket.  
   
   
       2 . The mechanism according to  claim 1 , wherein contacts provided at the socket are opened by the device for opening the socket.  
   
   
       3 . The mechanism according to  claim 1 , wherein the device for opening the socket is an attachment to the mechanism which is provided with a corresponding tapered plane.  
   
   
       4 . The mechanism according to  claim 1 , wherein the device is designed such that when the mechanism is moved toward the socket, contacts provided at the socket are opened by the device.  
   
   
       5 . The mechanism according to  claim 1 , further comprising an aligning device that aligns the mechanism in relation to the socket.  
   
   
       6 . The mechanism according to  claim 5 , wherein the aligning device has a tapered plane.  
   
   
       7 . The mechanism according to  claim 6 , wherein the aligning device has a conical section.  
   
   
       8 . The mechanism according to  claim 7 , wherein the aligning device is a recess provided at the mechanism.  
   
   
       9 . The mechanism according to  claim 5 , wherein the socket comprises a further alignment facilitating mechanism.  
   
   
       10 . The mechanism according to  claim 5 , wherein the aligning device attached to the mechanism is additionally used for aligning the mechanism in relation to a precision alignment device.  
   
   
       11 . A socket for semiconductor components, comprising a base element and contacts to be opened by a semiconductor component loading mechanism for loading the socket.  
   
   
       12 . The socket according to  claim 11 , wherein a mechanical device is provided for opening the socket.  
   
   
       13 . The socket according to  claim 11 , further comprising a facility for aligning the semiconductor component loading mechanism in relation to the socket.  
   
   
       14 . The socket according to  claim 13 , wherein the facility is a recess provided at the socket.  
   
   
       15 . The socket according to  claim 13 , wherein, to align the mechanism in relation to the socket, the mechanism is provided with a device, working in conjunction with the alignment facility provided at the socket.  
   
   
       16 . A process for loading a socket with a corresponding semiconductor component, comprising opening contacts in the socket with a socket loading mechanism.  
   
   
       17 . The process according to  claim 16 , wherein the socket loading mechanism has a tapered plane.  
   
   
       18 . The process according to  claim 16 , wherein the socket loading mechanism moves toward the contacts in the socket, which are opened by the socket loading mechanism.  
   
   
       19 . The process according to  claim 16 , further comprising aligning the socket loading mechanism in relation to the socket.  
   
   
       20 . The process according to  claim 19 , wherein the aligning is achieved by means of an alignment device provided on the socket loading mechanism.  
   
   
       21 . The process according to  claim 20 , wherein the alignment device has a tapered plane.  
   
   
       22 . The process according to  claim 20 , wherein, to align the socket loading mechanism in relation to the socket, a facility provided in the socket that works in conjunction with the alignment device provided at the mechanism.  
   
   
       23 . The process according to  claim 22 , further comprising: 
 moving the loading socket mechanism toward the socket; and    inserting the attachment provided at the mechanism into the recess provided at the socket.    
   
   
       24 . The process according to  claim 23 , further comprising aligning the mechanism in relation to a precision alignment device with assistance of the alignment device provided at the mechanism.