Chip element holder and method of handling chip elements

Abstract

Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.

1 . An electronic chip element handling apparatus for temporarily holding electronic chip elements during manufacture thereof, comprising: 
 a substrate plate made of a rigid material;    a holding plate of an elastomer and having an outer adhesive surface having an adhesive force strong enough to adhesively hold the electronic chip elements and weak enough to enable removal of the electronic chip elements;    several through holes passing through said substrate plate and said holding plate, each through hole remaining empty while having an open end at least partially closed by part of the predetermined surface of one of the electronic chip elements; and    a pusher member configured to exert an external force on the predetermined outer surfaces of the electronic chip elements bonded on the adhesive surface by way of the through holes, therein enabling the electronic chip elements to be separated from the holding plate.    
   
   
       2 . An electronic chip element handling apparatus for temporarily holding electronic chip elements during manufacture thereof comprising: 
 a substrate plate made of rigid material;    a holding plate of elastomer and having an outer adhesive surface with an adhesive force strong enough to adhesively hold the electronic chip elements and weak enough to enable removal of the electronic chip elements;    several through holes provided in said substrate plate and said holding plate, each through hole remaining empty while having an open end closed by part of the predetermined surface of one of the electronic chip elements; and    a pusher member configured to exert an external force on the predetermined outer surfaces of the electronic chip elements bonded on the adhesive surface by way of the through holes, therein enabling the electronic chip elements to be separated from the holding plate.    
   
   
       3 . An electronic chip element handling apparatus for temporarily holding electronic chip elements during manufacture thereof, comprising: 
 a substrate plate made of a rigid material;    first and second holding plates, formed of an elastomer and each having adhesive surfaces having an adhesive force strong enough to adhesively hold the electronic chip elements and weak enough to enable removal of the electronic chip elements, the first holding plate adhesive surface and the second holding plate adhesive surface opposing each other;    several through holes passing through said substrate plate and said first holding plate, each through hole remaining empty while having an open end at least partially closed by part of the predetermined surface of one of the electronic chip elements; and    a pusher member configured to exert an external force on the predetermined outer surfaces of the electronic chip elements bonded on the adhesive surface of the first holding plate by way of the through holes, therein enabling the electronic chip elements to be separated from the first holding plate.    
   
   
       4 . An electronic chip element handling apparatus for temporarily holding electronic chip elements during manufacture thereof comprising: 
 a substrate plate made of rigid material;    first and second holding plates, formed of an elastomer and each having adhesive surfaces having an adhesive force strong enough to adhesively hold the electronic chip elements and weak enough to enable removal of the electronic chip elements, the first holding plate adhesive surface and the second holding plate adhesive surface opposing each other;    several through holes provided in said substrate plate and said first holding plate, each through hole remaining empty while having an open end closed by part of the predetermined surface of one of the electronic chip elements; and    a pusher member configured to exert an external force on the predetermined outer surfaces of the electronic chip elements bonded on the adhesive surface of the first handling plate by way of the through holes, therein enabling the electronic chip elements to be separated from the first holding plate.