Cooling apparatus for electronic devices

Abstract

The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2 . In the liquid cooling unit 9 , a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10 . The heat generated by the heat generation components such as CPU 6 , heat generator 7 , and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.

1 . A cooling apparatus for cooling a heat generator in electronic devices comprises:
 a flow path, in which a coolant flows, embedded in a base;   a liquid cooling pump disposed above the base for circulating the coolant;   a liquid cooling unit embedded in the base for connecting the flow path and the liquid cooling pump; and   an air cooling unit member disposed on the base,   wherein the liquid cooling pump and the liquid cooling unit are integrated in a single unit of a metal materials.   
   
   
       2 . A cooling apparatus for cooling a heat generator in electronic devices comprises:
 an unit for liquid cooling having a flow path in which a coolant flows and a liquid cooling pump for circulating the coolant, both of which are embedded in a base; and   an air cooling unit member disposed on the base,   wherein the liquid cooling pump and the liquid cooling unit are integrated in a single unit of a metal material.   
   
   
       3 . A cooling apparatus according to  claim 1 , wherein the flow path is formed by joining a base having a groove and the heat absorption surface. 
   
   
       4 . A cooling apparatus according to  claim 2 , wherein the flow path is formed by joining a base having a groove and the heat absorption surface. 
   
   
       5 . A cooling apparatus according to  claims 1 , wherein an air cooling unit includes an air cooling fin group for exhausting heat, which is diffused by the liquid cooling unit, in atmosphere. 
   
   
       6 . A cooling apparatus according to  claims 2 , wherein an air cooling unit includes an air cooling fin group for exhausting heat, which is diffused by the liquid cooling unit, in atmosphere. 
   
   
       7 . A cooling apparatus according to  claim 2 , wherein the air cooling unit comprises an air cooling fan for flowing air to the air cooling fin group. 
   
   
       8 . A cooling apparatus according to  claim 1 , wherein the apparatus further comprises:
 an air cooling fan supplying air to a liquid cooling pump and to the air cooling fin group; and   an electric control circuit driving the liquid cooling pump and the air cooling fan,   wherein, an input to the electric control circuit is DC current.   
   
   
       9 . An electronic device mounting a cooling apparatus according to  claim 1 . 
   
   
       10 . An electronic device mounting a cooling apparatus according to  claim 2 . 
   
   
       11 . A cooling apparatus according to  claim 3 , wherein the air cooling fin group and the base are formed in a single unit.